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Microbial Interactions with Nanostructures and their Importance for the Development of Electrospun Nanofibrous Materials used in Regenerative Medicine and Filtration / Chris J Mortimer, Luke Burke, Chris Wright, Christopher Wright

Journal of Microbial & Biochemical Technology, Volume: 8, Issue: 3

Swansea University Author: Christopher Wright

Abstract

The growing use of electrospinning to fabricate nanofibrous structures for use in wound dressings, tissue engineering and filtration processes has increased the need for an understanding of the interactions between bacteria and nanostructures. The adhesion characteristics and colonisation of bacteri...

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Published in: Journal of Microbial & Biochemical Technology
ISSN: 1948-5948
Published: 2016
Online Access: Check full text

URI: https://cronfa.swan.ac.uk/Record/cronfa29207
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Abstract: The growing use of electrospinning to fabricate nanofibrous structures for use in wound dressings, tissue engineering and filtration processes has increased the need for an understanding of the interactions between bacteria and nanostructures. The adhesion characteristics and colonisation of bacteria on these materials is still not completely understood but is essential to aid their future development. This review presents the state of current research on microbial attachment at materials with micro- and nano- structures and how this research has been developed and adapted to study the interactions of bacteria with nanofibres. The few studies to date are discussed with the view to identifying the future studies required to increase understanding and allow the technology and application of electrospun nanofibres to move forward.
Item Description: This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
Keywords: Nanofibres; Electrospinning; Bacteria; Biofilm; Adhesion; Nanostructures; Antimicrobial; Antibiofilm
College: College of Engineering
Issue: 3