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Sensitivity analysis for the design of profile extrusion dies

J Sienz, A Goublomme, M Luege, Johann Sienz Orcid Logo

Computers & Structures, Volume: 88, Issue: 9-10, Pages: 610 - 624

Swansea University Author: Johann Sienz Orcid Logo

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Published in: Computers & Structures
ISSN: 0045-7949
Published: 2010
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Item Description: Paper on sensitivity analysis for extrusion die design. Industrial co-author. This work is part of the output from an FP funded project (EC ESPRIT Project 20124) with international industrial partners that was carried on in EPSRC funded work (EPSRC GR/M 95820 and EPSRC GR/R 67859/01) again with international industrial partners. The output of this work has been implemented in a commercial CFD solver. It makes large scale optimization possible for a wide range of problems using a mixture of geometric and materials variables in one frame work for the first time.
College: Faculty of Science and Engineering
Issue: 9-10
Start Page: 610
End Page: 624