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A study of low-strain and medium-strain grain boundary engineering
Acta Materialia, Volume: 57, Issue: 11, Pages: 3410 - 3421
Swansea University Authors: Valerie Randle, Mark Coleman
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DOI (Published version): 10.1016/j.actamat.2009.04.002
Grain boundary engineering (GBE) processing schedules, involving low-strain (5% deformation) iterative treatments, have been carried out on copper. Misorientation and grain boundary plane statistics have been derived, plus tensile and hardness measurements. The Σ3 length fraction and Σ9/Σ3 number ra...
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Grain boundary engineering (GBE) processing schedules, involving low-strain (5% deformation) iterative treatments, have been carried out on copper. Misorientation and grain boundary plane statistics have been derived, plus tensile and hardness measurements. The Σ3 length fraction and Σ9/Σ3 number ratio decreased during the first two processing iterations, whereas maximum GBE misorientation statistics were achieved after three processing iterations. Analysis of mechanical properties data revealed an accumulation of strain energy throughout the first three processing iterations, sufficient to provide enough driving force for extensive Σ3n interactions. The density of Σ3 boundaries had a larger effect on the rate of hardening than did the density of grain boundaries. This finding indicates the effectiveness of Σ3 interfaces as barriers to plastic flow, which plays an important role in the early stages of GBE processing. Data from samples that had undergone the low-strain iterations were also compared to medium-strain (25% deformation) processing iterations.
This work, which appeared in a 3.76 IF journal and has 10 citations so far, was funded by EPSRC grant EP/C51260X. A methodology for assessing the effectiveness of grain boundary engineering (GBE), based Σ3 length fraction and Σ9/Σ3 number ratio, was proposed and validated. The findings establish the effectiveness of Σ3 interfaces as barriers to plastic flow. This provides a convenient index for future work. The impact of this paper (and others)led to two keynote papers at international conferences, ‘ITAP-3’ and ‘Thermec2009’. The work also spawned a collaboration with a group in Germany (firstname.lastname@example.org) and a subsequent publication .
•Copper; •Electron backscattering diffraction (EBSD); •Grain boundary twin
Faculty of Science and Engineering