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Intermetallics: Applications / Jing Li, Mark Whittaker

Reference Module in Materials Science and Materials Engineering, Volume: 1, Pages: 339 - 349

Swansea University Authors: Jing Li, Mark Whittaker

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DOI (Published version): 10.1016/b978-0-12-819726-4.00041-7

Abstract

Intermetallic compounds exhibit an attractive combination of physical and mechanical properties such as high melting point, low density, high strength, good oxidation, and creep resistance. However, the room temperature brittleness of intermetallics has limited their structural use in a wide variety...

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Published in: Reference Module in Materials Science and Materials Engineering
ISBN: 9780128035818
Published: Elsevier 2020
URI: https://cronfa.swan.ac.uk/Record/cronfa55427
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Abstract: Intermetallic compounds exhibit an attractive combination of physical and mechanical properties such as high melting point, low density, high strength, good oxidation, and creep resistance. However, the room temperature brittleness of intermetallics has limited their structural use in a wide variety of applications. Since the 1980s, great progress has been achieved in the improvement of the ductility of several intermetallic compounds such as Ni3Al, TiAl, Fe3Al, FeAl, and Fe–Co–V alloys through alloying, processing, and microstructural control. This has led to a number of current and pending industrial applications. Meanwhile, many other compounds have been found to have unique physical properties such as superconductivity, hydrogen storage capability, high saturization, magnetization, etc. The scientific and technological achievements of the 1980s and 1990s will undoubtedly broaden the range of industrial applications for intermetallic compounds in structural and functional areas. In this article, the current status of intermetallic applications is briefly reviewed.
Keywords: Battery materials, Electronics and sensors, Iron aluminides, Magnetic materials, Molybdenum disilicide, Nickel aluminides, Titanium aluminides
College: College of Engineering
Start Page: 339
End Page: 349