No Cover Image

Journal article 265 views 32 downloads

Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics

Anil Bastola, Yinfeng He, Jisun Im Orcid Logo, Geoffrey Rivers, Feiran Wang, Robyn Worsley, Jonathan S. Austin Orcid Logo, Oliver Nelson-Dummett Orcid Logo, Ricky D. Wildman Orcid Logo, Richard Hague, Christopher J. Tuck Orcid Logo, Lyudmila Turyanska Orcid Logo

Materials Today Electronics, Volume: 6, Start page: 100058

Swansea University Author: Anil Bastola

  • 65764.VoR.pdf

    PDF | Version of Record

    © 2023 The Authors. This is an open access article under the CC BY license.

    Download (16.34MB)

Abstract

Inkjet printing offers a facile route for manufacturing the next generation of electronic devices, by combining the design freedom of additive manufacturing technologies with tuneable properties of functional materials and opportunities for their integration into heterostructures. However, to fully...

Full description

Published in: Materials Today Electronics
ISSN: 2772-9494
Published: Elsevier BV 2023
Online Access: Check full text

URI: https://cronfa.swan.ac.uk/Record/cronfa65764
Tags: Add Tag
No Tags, Be the first to tag this record!
first_indexed 2024-04-25T16:29:49Z
last_indexed 2024-04-25T16:29:49Z
id cronfa65764
recordtype SURis
fullrecord <?xml version="1.0" encoding="utf-8"?><rfc1807 xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:xsd="http://www.w3.org/2001/XMLSchema"><bib-version>v2</bib-version><id>65764</id><entry>2024-03-05</entry><title>Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics</title><swanseaauthors><author><sid>6775d40c935b36b92058eb10d6454f1a</sid><firstname>Anil</firstname><surname>Bastola</surname><name>Anil Bastola</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2024-03-05</date><deptcode>MECH</deptcode><abstract>Inkjet printing offers a facile route for manufacturing the next generation of electronic devices, by combining the design freedom of additive manufacturing technologies with tuneable properties of functional materials and opportunities for their integration into heterostructures. However, to fully realise this potential, the library of functional materials available for additive manufacturing technologies needs to be expanded. In this review, we summarise current developments in ink formulation strategies, approaches for tailoring the functional properties of inks, and multi-material processing. Material – process – property relationships are reviewed for emerging functional materials, such as polymers, nanomaterials, and composites, with examples of current state-of-the-art devices. The flexibility of combining inkjet deposition with other existing technologies and a variety of substrates is also discussed reviewing current trends in electronics and optoelectronics, including wearable electronics, sensing, and energy applications. The review offers a comprehensive and systematic overview of ink formulations for inkjet deposition of electronic devices, summarising the challenges and perspectives in the advancement of 3D and multi-functional electronic devices and smart electronics.</abstract><type>Journal Article</type><journal>Materials Today Electronics</journal><volume>6</volume><journalNumber/><paginationStart>100058</paginationStart><paginationEnd/><publisher>Elsevier BV</publisher><placeOfPublication/><isbnPrint/><isbnElectronic/><issnPrint>2772-9494</issnPrint><issnElectronic/><keywords>Ink formulation; Inkjet printing; Functional materials; Nanomaterials; Polymers; 3D electronics</keywords><publishedDay>1</publishedDay><publishedMonth>12</publishedMonth><publishedYear>2023</publishedYear><publishedDate>2023-12-01</publishedDate><doi>10.1016/j.mtelec.2023.100058</doi><url/><notes/><college>COLLEGE NANME</college><department>Mechanical Engineering</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>MECH</DepartmentCode><institution>Swansea University</institution><apcterm>Another institution paid the OA fee</apcterm><funders>This work was funded by the Engineering and Physical Sciences Research Council Programme Grant [grant number EP/P031684/1].</funders><projectreference/><lastEdited>2024-04-25T17:31:48.2064223</lastEdited><Created>2024-03-05T22:08:07.5498615</Created><path><level id="1">Faculty of Science and Engineering</level><level id="2">School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering</level></path><authors><author><firstname>Anil</firstname><surname>Bastola</surname><order>1</order></author><author><firstname>Yinfeng</firstname><surname>He</surname><order>2</order></author><author><firstname>Jisun</firstname><surname>Im</surname><orcid>0000-0002-9112-3828</orcid><order>3</order></author><author><firstname>Geoffrey</firstname><surname>Rivers</surname><order>4</order></author><author><firstname>Feiran</firstname><surname>Wang</surname><order>5</order></author><author><firstname>Robyn</firstname><surname>Worsley</surname><order>6</order></author><author><firstname>Jonathan S.</firstname><surname>Austin</surname><orcid>0000-0002-9247-2616</orcid><order>7</order></author><author><firstname>Oliver</firstname><surname>Nelson-Dummett</surname><orcid>0000-0002-4633-7536</orcid><order>8</order></author><author><firstname>Ricky D.</firstname><surname>Wildman</surname><orcid>0000-0003-2329-8471</orcid><order>9</order></author><author><firstname>Richard</firstname><surname>Hague</surname><order>10</order></author><author><firstname>Christopher J.</firstname><surname>Tuck</surname><orcid>0000-0003-0146-3851</orcid><order>11</order></author><author><firstname>Lyudmila</firstname><surname>Turyanska</surname><orcid>0000-0002-9552-6501</orcid><order>12</order></author></authors><documents><document><filename>65764__30157__450b38c25c2045519edabb37e00912df.pdf</filename><originalFilename>65764.VoR.pdf</originalFilename><uploaded>2024-04-25T17:30:54.8411885</uploaded><type>Output</type><contentLength>17137971</contentLength><contentType>application/pdf</contentType><version>Version of Record</version><cronfaStatus>true</cronfaStatus><documentNotes>© 2023 The Authors. This is an open access article under the CC BY license.</documentNotes><copyrightCorrect>true</copyrightCorrect><language>eng</language><licence>http://creativecommons.org/licenses/by/4.0/</licence></document></documents><OutputDurs/></rfc1807>
spelling v2 65764 2024-03-05 Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics 6775d40c935b36b92058eb10d6454f1a Anil Bastola Anil Bastola true false 2024-03-05 MECH Inkjet printing offers a facile route for manufacturing the next generation of electronic devices, by combining the design freedom of additive manufacturing technologies with tuneable properties of functional materials and opportunities for their integration into heterostructures. However, to fully realise this potential, the library of functional materials available for additive manufacturing technologies needs to be expanded. In this review, we summarise current developments in ink formulation strategies, approaches for tailoring the functional properties of inks, and multi-material processing. Material – process – property relationships are reviewed for emerging functional materials, such as polymers, nanomaterials, and composites, with examples of current state-of-the-art devices. The flexibility of combining inkjet deposition with other existing technologies and a variety of substrates is also discussed reviewing current trends in electronics and optoelectronics, including wearable electronics, sensing, and energy applications. The review offers a comprehensive and systematic overview of ink formulations for inkjet deposition of electronic devices, summarising the challenges and perspectives in the advancement of 3D and multi-functional electronic devices and smart electronics. Journal Article Materials Today Electronics 6 100058 Elsevier BV 2772-9494 Ink formulation; Inkjet printing; Functional materials; Nanomaterials; Polymers; 3D electronics 1 12 2023 2023-12-01 10.1016/j.mtelec.2023.100058 COLLEGE NANME Mechanical Engineering COLLEGE CODE MECH Swansea University Another institution paid the OA fee This work was funded by the Engineering and Physical Sciences Research Council Programme Grant [grant number EP/P031684/1]. 2024-04-25T17:31:48.2064223 2024-03-05T22:08:07.5498615 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering Anil Bastola 1 Yinfeng He 2 Jisun Im 0000-0002-9112-3828 3 Geoffrey Rivers 4 Feiran Wang 5 Robyn Worsley 6 Jonathan S. Austin 0000-0002-9247-2616 7 Oliver Nelson-Dummett 0000-0002-4633-7536 8 Ricky D. Wildman 0000-0003-2329-8471 9 Richard Hague 10 Christopher J. Tuck 0000-0003-0146-3851 11 Lyudmila Turyanska 0000-0002-9552-6501 12 65764__30157__450b38c25c2045519edabb37e00912df.pdf 65764.VoR.pdf 2024-04-25T17:30:54.8411885 Output 17137971 application/pdf Version of Record true © 2023 The Authors. This is an open access article under the CC BY license. true eng http://creativecommons.org/licenses/by/4.0/
title Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics
spellingShingle Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics
Anil Bastola
title_short Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics
title_full Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics
title_fullStr Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics
title_full_unstemmed Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics
title_sort Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics
author_id_str_mv 6775d40c935b36b92058eb10d6454f1a
author_id_fullname_str_mv 6775d40c935b36b92058eb10d6454f1a_***_Anil Bastola
author Anil Bastola
author2 Anil Bastola
Yinfeng He
Jisun Im
Geoffrey Rivers
Feiran Wang
Robyn Worsley
Jonathan S. Austin
Oliver Nelson-Dummett
Ricky D. Wildman
Richard Hague
Christopher J. Tuck
Lyudmila Turyanska
format Journal article
container_title Materials Today Electronics
container_volume 6
container_start_page 100058
publishDate 2023
institution Swansea University
issn 2772-9494
doi_str_mv 10.1016/j.mtelec.2023.100058
publisher Elsevier BV
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering
document_store_str 1
active_str 0
description Inkjet printing offers a facile route for manufacturing the next generation of electronic devices, by combining the design freedom of additive manufacturing technologies with tuneable properties of functional materials and opportunities for their integration into heterostructures. However, to fully realise this potential, the library of functional materials available for additive manufacturing technologies needs to be expanded. In this review, we summarise current developments in ink formulation strategies, approaches for tailoring the functional properties of inks, and multi-material processing. Material – process – property relationships are reviewed for emerging functional materials, such as polymers, nanomaterials, and composites, with examples of current state-of-the-art devices. The flexibility of combining inkjet deposition with other existing technologies and a variety of substrates is also discussed reviewing current trends in electronics and optoelectronics, including wearable electronics, sensing, and energy applications. The review offers a comprehensive and systematic overview of ink formulations for inkjet deposition of electronic devices, summarising the challenges and perspectives in the advancement of 3D and multi-functional electronic devices and smart electronics.
published_date 2023-12-01T17:31:47Z
_version_ 1797325017499828224
score 11.035655