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Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment

David Pervan, Anil Bastola Orcid Logo, Robyn Worsley, Ricky Wildman Orcid Logo, Richard Hague, Edward Lester Orcid Logo, Christopher Tuck Orcid Logo

Nanomaterials, Volume: 14, Issue: 9, Start page: 753

Swansea University Author: Anil Bastola Orcid Logo

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DOI (Published version): 10.3390/nano14090753

Abstract

The additive manufacturing (AM) of functional copper (Cu) parts is a major goal for many industries, from aerospace to automotive to electronics, because Cu has a high thermal and electrical conductivity as well as being ~10× cheaper than silver. Previous studies on AM of Cu have concentrated mainly...

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Published in: Nanomaterials
ISSN: 2079-4991
Published: MDPI AG
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URI: https://cronfa.swan.ac.uk/Record/cronfa66990
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spelling v2 66990 2024-07-08 Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment 6775d40c935b36b92058eb10d6454f1a 0000-0002-5598-0849 Anil Bastola Anil Bastola true false 2024-07-08 ACEM The additive manufacturing (AM) of functional copper (Cu) parts is a major goal for many industries, from aerospace to automotive to electronics, because Cu has a high thermal and electrical conductivity as well as being ~10× cheaper than silver. Previous studies on AM of Cu have concentrated mainly on high-energy manufacturing processes such as Laser Powder Bed Fusion, Electron Beam Melting, and Binder Jetting. These processes all require high-temperature heat treatment in an oxygen-free environment. This paper shows an AM route to multi-layered microparts from novel nanoparticle (NP) Cu feedstocks, performed in an air environment, employing a low-power (<10 W) laser sintering process. Cu NP ink was deposited using two mechanisms, inkjet printing, and bar coating, followed by low-power laser exposure to induce particle consolidation. Initial parts were manufactured to a height of approximately 100 µm, which was achieved by multi-layer printing of 15 (bar-coated) to 300 (inkjetted) layers. There was no evidence of oxidised copper in the sintered material, but they were found to be low-density, porous structures. Nonetheless, electrical resistivity of ~28 × 10−8 Ω m was achieved. Overall, the aim of this study is to offer foundational knowledge for upscaling the process to additively manufacture Cu 3D parts of significant size via sequential nanometal ink deposition and low-power laser processing. Journal Article Nanomaterials 14 9 753 MDPI AG 2079-4991 0 0 0 0001-01-01 10.3390/nano14090753 http://dx.doi.org/10.3390/nano14090753 COLLEGE NANME Aerospace, Civil, Electrical, and Mechanical Engineering COLLEGE CODE ACEM Swansea University Another institution paid the OA fee 2024-07-08T17:14:02.3352588 2024-07-08T17:10:44.3551969 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering David Pervan 1 Anil Bastola 0000-0002-5598-0849 2 Robyn Worsley 3 Ricky Wildman 0000-0003-2329-8471 4 Richard Hague 5 Edward Lester 0000-0003-1060-103x 6 Christopher Tuck 0000-0003-0146-3851 7
title Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
spellingShingle Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
Anil Bastola
title_short Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
title_full Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
title_fullStr Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
title_full_unstemmed Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
title_sort Additive Manufacturing of Electrically Conductive Multi-Layered Nanocopper in an Air Environment
author_id_str_mv 6775d40c935b36b92058eb10d6454f1a
author_id_fullname_str_mv 6775d40c935b36b92058eb10d6454f1a_***_Anil Bastola
author Anil Bastola
author2 David Pervan
Anil Bastola
Robyn Worsley
Ricky Wildman
Richard Hague
Edward Lester
Christopher Tuck
format Journal article
container_title Nanomaterials
container_volume 14
container_issue 9
container_start_page 753
institution Swansea University
issn 2079-4991
doi_str_mv 10.3390/nano14090753
publisher MDPI AG
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering
url http://dx.doi.org/10.3390/nano14090753
document_store_str 0
active_str 0
description The additive manufacturing (AM) of functional copper (Cu) parts is a major goal for many industries, from aerospace to automotive to electronics, because Cu has a high thermal and electrical conductivity as well as being ~10× cheaper than silver. Previous studies on AM of Cu have concentrated mainly on high-energy manufacturing processes such as Laser Powder Bed Fusion, Electron Beam Melting, and Binder Jetting. These processes all require high-temperature heat treatment in an oxygen-free environment. This paper shows an AM route to multi-layered microparts from novel nanoparticle (NP) Cu feedstocks, performed in an air environment, employing a low-power (<10 W) laser sintering process. Cu NP ink was deposited using two mechanisms, inkjet printing, and bar coating, followed by low-power laser exposure to induce particle consolidation. Initial parts were manufactured to a height of approximately 100 µm, which was achieved by multi-layer printing of 15 (bar-coated) to 300 (inkjetted) layers. There was no evidence of oxidised copper in the sintered material, but they were found to be low-density, porous structures. Nonetheless, electrical resistivity of ~28 × 10−8 Ω m was achieved. Overall, the aim of this study is to offer foundational knowledge for upscaling the process to additively manufacture Cu 3D parts of significant size via sequential nanometal ink deposition and low-power laser processing.
published_date 0001-01-01T17:14:01Z
_version_ 1804028075020648448
score 11.016235

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