Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys
| Date first appeared online | 29/03/2014 |
| DOI | 10.1016/j.microrel.2014.02.017 |
| Authors | Brown S., Sienz J., Lavery N., Davies H. |
| Journal Name | Microelectronics Reliability |
| Volume | 54 |