Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
| Date first appeared online | 31/12/2013 |
| DOI | 10.1109/EuroSimE.2013.6529901 |
| Authors | Brown S., Lavery N. |
| Journal Name | Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on |
| Volume |