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Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys / Steve, Brown; Nicholas, Lavery

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on

Swansea University Authors: Steve, Brown, Nicholas, Lavery

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DOI (Published version): 10.1109/EuroSimE.2013.6529901

Abstract

This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder al...

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Published in: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Published: Wroclaw, Poland IEEE Explore 2013
Online Access: http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6529901&tag=1
URI: https://cronfa.swan.ac.uk/Record/cronfa15168
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Abstract: This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder alloys including SAC105, SAC305, SAC405 and Sn-36Pb-2Ag. Both the impacts of thermal power cycles (80 to 150 °C) and thermal sh°Ck cycles (−40 to 125 °C) on solders were simulated by using the constitutive equation based on Anand's viscoplasticity model. From these results, lifetime-predictions of solder joints were derived using Coffin Manson procedures.
Keywords: Lead free solder, computational modelling, creep-fatigue
College: College of Engineering
End Page: 8