Conference Paper/Proceeding/Abstract 1299 views
Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on
Swansea University Authors:
Steve Brown, Nicholas Lavery
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DOI (Published version): 10.1109/EuroSimE.2013.6529901
Abstract
This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder al...
Published in: | Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on |
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Published: |
Wroclaw, Poland
IEEE Explore
2013
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Online Access: |
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6529901&tag=1 |
URI: | https://cronfa.swan.ac.uk/Record/cronfa15168 |
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<?xml version="1.0"?><rfc1807><datestamp>2015-08-31T14:22:17.4662937</datestamp><bib-version>v2</bib-version><id>15168</id><entry>2013-07-05</entry><title>Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys</title><swanseaauthors><author><sid>07a865adc76376646bc6c03a69ce35a9</sid><firstname>Steve</firstname><surname>Brown</surname><name>Steve Brown</name><active>true</active><ethesisStudent>false</ethesisStudent></author><author><sid>9f102ff59824fd4f7ce3d40144304395</sid><ORCID>0000-0003-0953-5936</ORCID><firstname>Nicholas</firstname><surname>Lavery</surname><name>Nicholas Lavery</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2013-07-05</date><deptcode>FGSEN</deptcode><abstract>This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder alloys including SAC105, SAC305, SAC405 and Sn-36Pb-2Ag. Both the impacts of thermal power cycles (80 to 150 °C) and thermal sh°Ck cycles (−40 to 125 °C) on solders were simulated by using the constitutive equation based on Anand's viscoplasticity model. From these results, lifetime-predictions of solder joints were derived using Coffin Manson procedures.</abstract><type>Conference Paper/Proceeding/Abstract</type><journal>Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on</journal><volume></volume><journalNumber></journalNumber><paginationStart/><paginationEnd>8</paginationEnd><publisher>IEEE Explore</publisher><placeOfPublication>Wroclaw, Poland</placeOfPublication><issnPrint/><issnElectronic/><keywords>Lead free solder, computational modelling, creep-fatigue</keywords><publishedDay>16</publishedDay><publishedMonth>4</publishedMonth><publishedYear>2013</publishedYear><publishedDate>2013-04-16</publishedDate><doi>10.1109/EuroSimE.2013.6529901</doi><url>http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6529901&amp;tag=1</url><notes/><college>COLLEGE NANME</college><department>Science and Engineering - Faculty</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>FGSEN</DepartmentCode><institution>Swansea University</institution><apcterm/><lastEdited>2015-08-31T14:22:17.4662937</lastEdited><Created>2013-07-05T12:23:13.9458167</Created><path><level id="1">Faculty of Science and Engineering</level><level id="2">School of Engineering and Applied Sciences - Uncategorised</level></path><authors><author><firstname>J</firstname><surname>Eckermann</surname><order>1</order></author><author><firstname>S</firstname><surname>Mehmood</surname><order>2</order></author><author><firstname>H.M</firstname><surname>Davies</surname><order>3</order></author><author><firstname>N. P</firstname><surname>Lavery</surname><order>4</order></author><author><firstname>S.G.R</firstname><surname>Brown</surname><order>5</order></author><author><firstname>J</firstname><surname>Sienz</surname><order>6</order></author><author><firstname>A</firstname><surname>Jones</surname><order>7</order></author><author><firstname>P</firstname><surname>Sommerfeld</surname><order>8</order></author><author><firstname>Steve</firstname><surname>Brown</surname><order>9</order></author><author><firstname>Nicholas</firstname><surname>Lavery</surname><orcid>0000-0003-0953-5936</orcid><order>10</order></author></authors><documents/><OutputDurs/></rfc1807> |
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2015-08-31T14:22:17.4662937 v2 15168 2013-07-05 Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys 07a865adc76376646bc6c03a69ce35a9 Steve Brown Steve Brown true false 9f102ff59824fd4f7ce3d40144304395 0000-0003-0953-5936 Nicholas Lavery Nicholas Lavery true false 2013-07-05 FGSEN This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder alloys including SAC105, SAC305, SAC405 and Sn-36Pb-2Ag. Both the impacts of thermal power cycles (80 to 150 °C) and thermal sh°Ck cycles (−40 to 125 °C) on solders were simulated by using the constitutive equation based on Anand's viscoplasticity model. From these results, lifetime-predictions of solder joints were derived using Coffin Manson procedures. Conference Paper/Proceeding/Abstract Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on 8 IEEE Explore Wroclaw, Poland Lead free solder, computational modelling, creep-fatigue 16 4 2013 2013-04-16 10.1109/EuroSimE.2013.6529901 http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6529901&tag=1 COLLEGE NANME Science and Engineering - Faculty COLLEGE CODE FGSEN Swansea University 2015-08-31T14:22:17.4662937 2013-07-05T12:23:13.9458167 Faculty of Science and Engineering School of Engineering and Applied Sciences - Uncategorised J Eckermann 1 S Mehmood 2 H.M Davies 3 N. P Lavery 4 S.G.R Brown 5 J Sienz 6 A Jones 7 P Sommerfeld 8 Steve Brown 9 Nicholas Lavery 0000-0003-0953-5936 10 |
title |
Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys |
spellingShingle |
Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys Steve Brown Nicholas Lavery |
title_short |
Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys |
title_full |
Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys |
title_fullStr |
Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys |
title_full_unstemmed |
Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys |
title_sort |
Computational modelling of creep-based fatigue as a means of selecting lead-free solder alloys |
author_id_str_mv |
07a865adc76376646bc6c03a69ce35a9 9f102ff59824fd4f7ce3d40144304395 |
author_id_fullname_str_mv |
07a865adc76376646bc6c03a69ce35a9_***_Steve Brown 9f102ff59824fd4f7ce3d40144304395_***_Nicholas Lavery |
author |
Steve Brown Nicholas Lavery |
author2 |
J Eckermann S Mehmood H.M Davies N. P Lavery S.G.R Brown J Sienz A Jones P Sommerfeld Steve Brown Nicholas Lavery |
format |
Conference Paper/Proceeding/Abstract |
container_title |
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on |
publishDate |
2013 |
institution |
Swansea University |
doi_str_mv |
10.1109/EuroSimE.2013.6529901 |
publisher |
IEEE Explore |
college_str |
Faculty of Science and Engineering |
hierarchytype |
|
hierarchy_top_id |
facultyofscienceandengineering |
hierarchy_top_title |
Faculty of Science and Engineering |
hierarchy_parent_id |
facultyofscienceandengineering |
hierarchy_parent_title |
Faculty of Science and Engineering |
department_str |
School of Engineering and Applied Sciences - Uncategorised{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Engineering and Applied Sciences - Uncategorised |
url |
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6529901&tag=1 |
document_store_str |
0 |
active_str |
0 |
description |
This investigation looked at the effect of temperature fluctuations on a number of solders used for varying joint configurations. Three different joint assemblies (a ball joint, a test specimen joint and finger lead joint) were chosen to simulate the creep and fatigue behaviours of various solder alloys including SAC105, SAC305, SAC405 and Sn-36Pb-2Ag. Both the impacts of thermal power cycles (80 to 150 °C) and thermal sh°Ck cycles (−40 to 125 °C) on solders were simulated by using the constitutive equation based on Anand's viscoplasticity model. From these results, lifetime-predictions of solder joints were derived using Coffin Manson procedures. |
published_date |
2013-04-16T03:17:17Z |
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1763750379816747008 |
score |
11.021648 |