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Deposition of High Conductivity Low Silver Content Materials by Screen Printing

Eifion Jewell Orcid Logo, Simon Hamblyn, Tim Claypole Orcid Logo, David Gethin Orcid Logo

Coatings, Volume: 5, Issue: 2, Pages: 172 - 185

Swansea University Authors: Eifion Jewell Orcid Logo, Simon Hamblyn, Tim Claypole Orcid Logo, David Gethin Orcid Logo

Abstract

A comprehensive experimental investigation has been carried out into the role of film thickness variation and silver material formulation on printing capability in the screen printing process. A full factorial experiment was carried out where two formulations of silver materials were printed through...

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Published in: Coatings
ISSN: 2079-6412 2079-6412
Published: 2015
Online Access: Check full text

URI: https://cronfa.swan.ac.uk/Record/cronfa25654
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Abstract: A comprehensive experimental investigation has been carried out into the role of film thickness variation and silver material formulation on printing capability in the screen printing process. A full factorial experiment was carried out where two formulations of silver materials were printed through a range of screens to a polyester substrate under a set of standard conditions. The materials represented a novel low silver content (45%–49%) polymer material and traditional high silver content (65%–69%) paste. The resultant prints were characterised topologically and electrically. The study shows that more cost effective use of the silver in the ink was obtained with the low silver polymer materials, but that the electrical performance was more strongly affected by the mesh being used (and hence film thickness). Thus, while optimum silver use could be obtained using materials with a lower silver content, this came with the consequence of reduced process robustness.
Item Description: This is an open access article distributed under the Creative Commons Attribution License (CC BY) which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
College: Faculty of Science and Engineering
Issue: 2
Start Page: 172
End Page: 185