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Printed-Sensor-on-Chip devices – Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits

Ben Clifford Orcid Logo, David Beynon Orcid Logo, Christopher Phillips Orcid Logo, Davide Deganello Orcid Logo

Sensors and Actuators B: Chemical, Volume: 255, Issue: 1, Pages: 1031 - 1038

Swansea University Authors: Ben Clifford Orcid Logo, David Beynon Orcid Logo, Christopher Phillips Orcid Logo, Davide Deganello Orcid Logo

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DOI (Published version): 10.1016/j.snb.2017.08.086

Abstract

In this paper we report on the development of an aerosol jet printed sensing platform integrating elements of silicon and printed electronics. To demonstrate the technology, thin film humidity sensors have been fabricated over the top surface and sides of pre-packaged integrated circuits using a com...

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Published in: Sensors and Actuators B: Chemical
ISSN: 0925-4005
Published: 2018
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URI: https://cronfa.swan.ac.uk/Record/cronfa35009
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spelling 2020-10-29T12:12:47.8950093 v2 35009 2017-08-24 Printed-Sensor-on-Chip devices – Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits eaaa538f5503e162cf91e18e06d58843 0000-0002-5111-3799 Ben Clifford Ben Clifford true false f5cf40043658d0b8a747ef6224019939 0000-0002-8189-9489 David Beynon David Beynon true false cc734f776f10b3fb9b43816c9f617bb5 0000-0001-8011-710X Christopher Phillips Christopher Phillips true false ea38a0040bdfd3875506189e3629b32a 0000-0001-8341-4177 Davide Deganello Davide Deganello true false 2017-08-24 CHEM In this paper we report on the development of an aerosol jet printed sensing platform integrating elements of silicon and printed electronics. To demonstrate the technology, thin film humidity sensors have been fabricated over the top surface and sides of pre-packaged integrated circuits using a combination of direct-write aerosol jet deposition and drop-casting. The resistive based sensor consists of an aerosol jet deposited interdigitated nano-particle silver electrode structure overlaid with a thin film of Nafion® acting as a humidity sensitive layer. The fabricated sensor displayed a strong response to changes in relative humidity over the tested range (40% RH to 80% RH) and showed a low level of hysteresis whilst undergoing cyclic testing. The successful fabrication of relative humidity sensors over the surface and pins of a packaged integrated circuit demonstrates a new level of integration between printed and silicon based electronics − leading to Printed-Sensor-on-Chip devices. Whilst demonstrated for humidity, the proposed concept is envisaged to work as a platform for a wide range of applications, from bio-sensing to temperature or gas monitoring. Journal Article Sensors and Actuators B: Chemical 255 1 1031 1038 0925-4005 Sensor-on-Chip; Aerosol Jet Deposition; Printed Electronics; Humidity Sensor; Nafion 1 2 2018 2018-02-01 10.1016/j.snb.2017.08.086 RCUK, EP/N013727/1 COLLEGE NANME Chemistry COLLEGE CODE CHEM Swansea University RCUK, EP/N013727/1 RCUK, EP/N013727/1. , EP/M028267/1 2020-10-29T12:12:47.8950093 2017-08-24T14:02:52.8968203 Faculty of Science and Engineering School of Engineering and Applied Sciences - Chemical Engineering Ben Clifford 0000-0002-5111-3799 1 David Beynon 0000-0002-8189-9489 2 Christopher Phillips 0000-0001-8011-710X 3 Davide Deganello 0000-0001-8341-4177 4 0035009-22112017101635.pdf 35009.pdf 2017-11-22T10:16:35.0230000 Output 2648056 application/pdf Version of Record true 2017-11-22T00:00:00.0000000 Released under the terms of a Creative Commons Attribution License (CC BY). true eng
title Printed-Sensor-on-Chip devices – Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits
spellingShingle Printed-Sensor-on-Chip devices – Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits
Ben Clifford
David Beynon
Christopher Phillips
Davide Deganello
title_short Printed-Sensor-on-Chip devices – Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits
title_full Printed-Sensor-on-Chip devices – Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits
title_fullStr Printed-Sensor-on-Chip devices – Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits
title_full_unstemmed Printed-Sensor-on-Chip devices – Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits
title_sort Printed-Sensor-on-Chip devices – Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits
author_id_str_mv eaaa538f5503e162cf91e18e06d58843
f5cf40043658d0b8a747ef6224019939
cc734f776f10b3fb9b43816c9f617bb5
ea38a0040bdfd3875506189e3629b32a
author_id_fullname_str_mv eaaa538f5503e162cf91e18e06d58843_***_Ben Clifford
f5cf40043658d0b8a747ef6224019939_***_David Beynon
cc734f776f10b3fb9b43816c9f617bb5_***_Christopher Phillips
ea38a0040bdfd3875506189e3629b32a_***_Davide Deganello
author Ben Clifford
David Beynon
Christopher Phillips
Davide Deganello
author2 Ben Clifford
David Beynon
Christopher Phillips
Davide Deganello
format Journal article
container_title Sensors and Actuators B: Chemical
container_volume 255
container_issue 1
container_start_page 1031
publishDate 2018
institution Swansea University
issn 0925-4005
doi_str_mv 10.1016/j.snb.2017.08.086
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Engineering and Applied Sciences - Chemical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Engineering and Applied Sciences - Chemical Engineering
document_store_str 1
active_str 0
description In this paper we report on the development of an aerosol jet printed sensing platform integrating elements of silicon and printed electronics. To demonstrate the technology, thin film humidity sensors have been fabricated over the top surface and sides of pre-packaged integrated circuits using a combination of direct-write aerosol jet deposition and drop-casting. The resistive based sensor consists of an aerosol jet deposited interdigitated nano-particle silver electrode structure overlaid with a thin film of Nafion® acting as a humidity sensitive layer. The fabricated sensor displayed a strong response to changes in relative humidity over the tested range (40% RH to 80% RH) and showed a low level of hysteresis whilst undergoing cyclic testing. The successful fabrication of relative humidity sensors over the surface and pins of a packaged integrated circuit demonstrates a new level of integration between printed and silicon based electronics − leading to Printed-Sensor-on-Chip devices. Whilst demonstrated for humidity, the proposed concept is envisaged to work as a platform for a wide range of applications, from bio-sensing to temperature or gas monitoring.
published_date 2018-02-01T03:43:27Z
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score 11.016258

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