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A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment

Harry Fulton, Oliver Ansell, Janet Hopkins, Martin Hanicinec, Takuo Nishida, Taku Umemoto, Lijie Li Orcid Logo

IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 10, Issue: 4, Pages: 694 - 703

Swansea University Author: Lijie Li Orcid Logo

Abstract

The main objective of this article is to establish which of the many dicing tapes used in the semiconductor industry would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision...

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Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN: 2156-3950 2156-3985
Published: Institute of Electrical and Electronics Engineers (IEEE) 2020
Online Access: Check full text

URI: https://cronfa.swan.ac.uk/Record/cronfa53280
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Abstract: The main objective of this article is to establish which of the many dicing tapes used in the semiconductor industry would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision of integrated circuit packaging. Die singulation has traditionally been accomplished using a diamond saw, laser-based technology, or a combination of both. The stress on dicing tape was, therefore, limited to fatigue through the physical nature of saw dicing or heat energies induced during laser dicing. These processes do not expose dicing tape to either a high vacuum or a variety of plasma chemistries. This investigative work is a continuation of studies examining the dicing tape behavior when used in plasma dicing. Results show that polyolefin (PO) UV tape with low-to-medium adhesion strength exhibits the greatest resilience under harsh plasma etch conditions and that efficient photoinitiated cross linking (or curing) of the adhesive is triggered if directly exposed to the photonic energies present in a pure SF 6 plasma or full plasma dicing process. However, the postplasma dice, post-UV cure adhesive strength can still be minimized if the tape manufacturers recommended time limitations between which the tape mount, plasma dice, and die pickup process are adhered to.
Keywords: dicing , plasma , singulation , UV-tape , anti-ESD
College: Faculty of Science and Engineering
Issue: 4
Start Page: 694
End Page: 703