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A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment
IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 10, Issue: 4, Pages: 694 - 703
Swansea University Author: Lijie Li
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DOI (Published version): 10.1109/tcpmt.2020.2966724
Abstract
The main objective of this article is to establish which of the many dicing tapes used in the semiconductor industry would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision...
Published in: | IEEE Transactions on Components, Packaging and Manufacturing Technology |
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ISSN: | 2156-3950 2156-3985 |
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Institute of Electrical and Electronics Engineers (IEEE)
2020
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URI: | https://cronfa.swan.ac.uk/Record/cronfa53280 |
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<?xml version="1.0"?><rfc1807><datestamp>2022-08-26T14:22:40.7015816</datestamp><bib-version>v2</bib-version><id>53280</id><entry>2020-01-16</entry><title>A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment</title><swanseaauthors><author><sid>ed2c658b77679a28e4c1dcf95af06bd6</sid><ORCID>0000-0003-4630-7692</ORCID><firstname>Lijie</firstname><surname>Li</surname><name>Lijie Li</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2020-01-16</date><deptcode>EEEG</deptcode><abstract>The main objective of this article is to establish which of the many dicing tapes used in the semiconductor industry would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision of integrated circuit packaging. Die singulation has traditionally been accomplished using a diamond saw, laser-based technology, or a combination of both. The stress on dicing tape was, therefore, limited to fatigue through the physical nature of saw dicing or heat energies induced during laser dicing. These processes do not expose dicing tape to either a high vacuum or a variety of plasma chemistries. This investigative work is a continuation of studies examining the dicing tape behavior when used in plasma dicing. Results show that polyolefin (PO) UV tape with low-to-medium adhesion strength exhibits the greatest resilience under harsh plasma etch conditions and that efficient photoinitiated cross linking (or curing) of the adhesive is triggered if directly exposed to the photonic energies present in a pure SF 6 plasma or full plasma dicing process. However, the postplasma dice, post-UV cure adhesive strength can still be minimized if the tape manufacturers recommended time limitations between which the tape mount, plasma dice, and die pickup process are adhered to.</abstract><type>Journal Article</type><journal>IEEE Transactions on Components, Packaging and Manufacturing Technology</journal><volume>10</volume><journalNumber>4</journalNumber><paginationStart>694</paginationStart><paginationEnd>703</paginationEnd><publisher>Institute of Electrical and Electronics Engineers (IEEE)</publisher><placeOfPublication/><isbnPrint/><isbnElectronic/><issnPrint>2156-3950</issnPrint><issnElectronic>2156-3985</issnElectronic><keywords>dicing , plasma , singulation , UV-tape , anti-ESD</keywords><publishedDay>1</publishedDay><publishedMonth>4</publishedMonth><publishedYear>2020</publishedYear><publishedDate>2020-04-01</publishedDate><doi>10.1109/tcpmt.2020.2966724</doi><url/><notes/><college>COLLEGE NANME</college><department>Electronic and Electrical Engineering</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>EEEG</DepartmentCode><institution>Swansea University</institution><apcterm/><funders/><projectreference/><lastEdited>2022-08-26T14:22:40.7015816</lastEdited><Created>2020-01-16T08:01:04.1929789</Created><path><level id="1">Faculty of Science and Engineering</level><level id="2">School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering</level></path><authors><author><firstname>Harry</firstname><surname>Fulton</surname><order>1</order></author><author><firstname>Oliver</firstname><surname>Ansell</surname><order>2</order></author><author><firstname>Janet</firstname><surname>Hopkins</surname><order>3</order></author><author><firstname>Martin</firstname><surname>Hanicinec</surname><order>4</order></author><author><firstname>Takuo</firstname><surname>Nishida</surname><order>5</order></author><author><firstname>Taku</firstname><surname>Umemoto</surname><order>6</order></author><author><firstname>Lijie</firstname><surname>Li</surname><orcid>0000-0003-4630-7692</orcid><order>7</order></author></authors><documents><document><filename>53280__16918__7d7d6505cca14327ab7dc8ff43ba3092.pdf</filename><originalFilename>53280.pdf</originalFilename><uploaded>2020-03-25T13:09:33.3765797</uploaded><type>Output</type><contentLength>1157034</contentLength><contentType>application/pdf</contentType><version>Accepted Manuscript</version><cronfaStatus>true</cronfaStatus><embargoDate>2020-01-15T00:00:00.0000000</embargoDate><copyrightCorrect>true</copyrightCorrect><language>eng</language></document></documents><OutputDurs/></rfc1807> |
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2022-08-26T14:22:40.7015816 v2 53280 2020-01-16 A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment ed2c658b77679a28e4c1dcf95af06bd6 0000-0003-4630-7692 Lijie Li Lijie Li true false 2020-01-16 EEEG The main objective of this article is to establish which of the many dicing tapes used in the semiconductor industry would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision of integrated circuit packaging. Die singulation has traditionally been accomplished using a diamond saw, laser-based technology, or a combination of both. The stress on dicing tape was, therefore, limited to fatigue through the physical nature of saw dicing or heat energies induced during laser dicing. These processes do not expose dicing tape to either a high vacuum or a variety of plasma chemistries. This investigative work is a continuation of studies examining the dicing tape behavior when used in plasma dicing. Results show that polyolefin (PO) UV tape with low-to-medium adhesion strength exhibits the greatest resilience under harsh plasma etch conditions and that efficient photoinitiated cross linking (or curing) of the adhesive is triggered if directly exposed to the photonic energies present in a pure SF 6 plasma or full plasma dicing process. However, the postplasma dice, post-UV cure adhesive strength can still be minimized if the tape manufacturers recommended time limitations between which the tape mount, plasma dice, and die pickup process are adhered to. Journal Article IEEE Transactions on Components, Packaging and Manufacturing Technology 10 4 694 703 Institute of Electrical and Electronics Engineers (IEEE) 2156-3950 2156-3985 dicing , plasma , singulation , UV-tape , anti-ESD 1 4 2020 2020-04-01 10.1109/tcpmt.2020.2966724 COLLEGE NANME Electronic and Electrical Engineering COLLEGE CODE EEEG Swansea University 2022-08-26T14:22:40.7015816 2020-01-16T08:01:04.1929789 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering Harry Fulton 1 Oliver Ansell 2 Janet Hopkins 3 Martin Hanicinec 4 Takuo Nishida 5 Taku Umemoto 6 Lijie Li 0000-0003-4630-7692 7 53280__16918__7d7d6505cca14327ab7dc8ff43ba3092.pdf 53280.pdf 2020-03-25T13:09:33.3765797 Output 1157034 application/pdf Accepted Manuscript true 2020-01-15T00:00:00.0000000 true eng |
title |
A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment |
spellingShingle |
A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment Lijie Li |
title_short |
A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment |
title_full |
A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment |
title_fullStr |
A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment |
title_full_unstemmed |
A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment |
title_sort |
A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment |
author_id_str_mv |
ed2c658b77679a28e4c1dcf95af06bd6 |
author_id_fullname_str_mv |
ed2c658b77679a28e4c1dcf95af06bd6_***_Lijie Li |
author |
Lijie Li |
author2 |
Harry Fulton Oliver Ansell Janet Hopkins Martin Hanicinec Takuo Nishida Taku Umemoto Lijie Li |
format |
Journal article |
container_title |
IEEE Transactions on Components, Packaging and Manufacturing Technology |
container_volume |
10 |
container_issue |
4 |
container_start_page |
694 |
publishDate |
2020 |
institution |
Swansea University |
issn |
2156-3950 2156-3985 |
doi_str_mv |
10.1109/tcpmt.2020.2966724 |
publisher |
Institute of Electrical and Electronics Engineers (IEEE) |
college_str |
Faculty of Science and Engineering |
hierarchytype |
|
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facultyofscienceandengineering |
hierarchy_top_title |
Faculty of Science and Engineering |
hierarchy_parent_id |
facultyofscienceandengineering |
hierarchy_parent_title |
Faculty of Science and Engineering |
department_str |
School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering |
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description |
The main objective of this article is to establish which of the many dicing tapes used in the semiconductor industry would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision of integrated circuit packaging. Die singulation has traditionally been accomplished using a diamond saw, laser-based technology, or a combination of both. The stress on dicing tape was, therefore, limited to fatigue through the physical nature of saw dicing or heat energies induced during laser dicing. These processes do not expose dicing tape to either a high vacuum or a variety of plasma chemistries. This investigative work is a continuation of studies examining the dicing tape behavior when used in plasma dicing. Results show that polyolefin (PO) UV tape with low-to-medium adhesion strength exhibits the greatest resilience under harsh plasma etch conditions and that efficient photoinitiated cross linking (or curing) of the adhesive is triggered if directly exposed to the photonic energies present in a pure SF 6 plasma or full plasma dicing process. However, the postplasma dice, post-UV cure adhesive strength can still be minimized if the tape manufacturers recommended time limitations between which the tape mount, plasma dice, and die pickup process are adhered to. |
published_date |
2020-04-01T04:06:09Z |
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1763753454421934080 |
score |
11.016258 |