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The joining of gamma titanium aluminides via the powder interlayer bonding method / Peter Davies, Helen Davies, I. Watkins, Daniel Britton

The International Journal of Advanced Manufacturing Technology, Volume: 109, Issue: 7-8, Pages: 2049 - 2054

Swansea University Authors: Peter Davies, Helen Davies, Daniel Britton

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Abstract

Powder interlayer bonding (PIB) is a joining technique originally developed to enable high-integrity repairs of aerospace components. The technique has previously been employed for the joining of titanium and nickel alloys utilised in the aerospace industry. This study expands on the application of...

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Published in: The International Journal of Advanced Manufacturing Technology
ISSN: 0268-3768 1433-3015
Published: Springer Science and Business Media LLC 2020
Online Access: Check full text

URI: https://cronfa.swan.ac.uk/Record/cronfa54683
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Abstract: Powder interlayer bonding (PIB) is a joining technique originally developed to enable high-integrity repairs of aerospace components. The technique has previously been employed for the joining of titanium and nickel alloys utilised in the aerospace industry. This study expands on the application of the novel joining technique known as powder interlayer bonding (PIB), to the bonding of γ titanium aluminide (TiAl) material. PIB has been used to facilitate high-integrity joints in gamma titanium aluminides (TiAl), where full densification of the joint was achieved. The PIB technique described here used a metallic powder interlayer between the two faying surfaces of γ TiAl specimens. Bonds were formed in an inert atmosphere under induction heating. The PIB technique proved capable of producing high-integrity bonds in terms of microstructural evaluation, with very limited porosity retained after the bonding cycle. A brittle Ti2Al phase can be produced with heavily oxidised powder which is susceptible to cracking and will negatively affect mechanical properties.
Keywords: Powder interlayer bonding (PIB); Gamma titanium aluminides
College: College of Engineering
Funders: EPSRC
Issue: 7-8
Start Page: 2049
End Page: 2054