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The joining of gamma titanium aluminides via the powder interlayer bonding method

Peter Davies, Helen Davies Orcid Logo, I. Watkins, Daniel Britton

The International Journal of Advanced Manufacturing Technology, Volume: 109, Issue: 7-8, Pages: 2049 - 2054

Swansea University Authors: Peter Davies , Helen Davies Orcid Logo, Daniel Britton

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Abstract

Powder interlayer bonding (PIB) is a joining technique originally developed to enable high-integrity repairs of aerospace components. The technique has previously been employed for the joining of titanium and nickel alloys utilised in the aerospace industry. This study expands on the application of...

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Published in: The International Journal of Advanced Manufacturing Technology
ISSN: 0268-3768 1433-3015
Published: Springer Science and Business Media LLC 2020
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URI: https://cronfa.swan.ac.uk/Record/cronfa54683
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spelling 2021-12-01T13:59:28.4038446 v2 54683 2020-07-10 The joining of gamma titanium aluminides via the powder interlayer bonding method 6001f4a98b5ed1259d64498333697ca5 Peter Davies Peter Davies true false a5277aa17f0f10a481da9e9751ccaeef 0000-0003-4838-9572 Helen Davies Helen Davies true false 09da4807d902e139e89b80e6cd3e8fd5 Daniel Britton Daniel Britton true false 2020-07-10 MTLS Powder interlayer bonding (PIB) is a joining technique originally developed to enable high-integrity repairs of aerospace components. The technique has previously been employed for the joining of titanium and nickel alloys utilised in the aerospace industry. This study expands on the application of the novel joining technique known as powder interlayer bonding (PIB), to the bonding of γ titanium aluminide (TiAl) material. PIB has been used to facilitate high-integrity joints in gamma titanium aluminides (TiAl), where full densification of the joint was achieved. The PIB technique described here used a metallic powder interlayer between the two faying surfaces of γ TiAl specimens. Bonds were formed in an inert atmosphere under induction heating. The PIB technique proved capable of producing high-integrity bonds in terms of microstructural evaluation, with very limited porosity retained after the bonding cycle. A brittle Ti2Al phase can be produced with heavily oxidised powder which is susceptible to cracking and will negatively affect mechanical properties. Journal Article The International Journal of Advanced Manufacturing Technology 109 7-8 2049 2054 Springer Science and Business Media LLC 0268-3768 1433-3015 Powder interlayer bonding (PIB); Gamma titanium aluminides 1 8 2020 2020-08-01 10.1007/s00170-020-05725-9 COLLEGE NANME Materials Science and Engineering COLLEGE CODE MTLS Swansea University SU Library paid the OA fee (TA Institutional Deal) EPSRC EP/R511614/1 2021-12-01T13:59:28.4038446 2020-07-10T09:09:03.3070824 College of Engineering Engineering Peter Davies 1 Helen Davies 0000-0003-4838-9572 2 I. Watkins 3 Daniel Britton 4 54683__17842__295fe2681a9b447cb9eaf3105d32c3f5.pdf 54683.pdf 2020-08-03T17:27:06.6422336 Output 1189005 application/pdf Version of Record true Released under the terms of a Creative Commons Attribution 4.0 International License (CC-BY). true English http://creativecommons.org/licenses/by/4.0/
title The joining of gamma titanium aluminides via the powder interlayer bonding method
spellingShingle The joining of gamma titanium aluminides via the powder interlayer bonding method
Peter, Davies
Helen, Davies
Daniel, Britton
title_short The joining of gamma titanium aluminides via the powder interlayer bonding method
title_full The joining of gamma titanium aluminides via the powder interlayer bonding method
title_fullStr The joining of gamma titanium aluminides via the powder interlayer bonding method
title_full_unstemmed The joining of gamma titanium aluminides via the powder interlayer bonding method
title_sort The joining of gamma titanium aluminides via the powder interlayer bonding method
author_id_str_mv 6001f4a98b5ed1259d64498333697ca5
a5277aa17f0f10a481da9e9751ccaeef
09da4807d902e139e89b80e6cd3e8fd5
author_id_fullname_str_mv 6001f4a98b5ed1259d64498333697ca5_***_Peter, Davies_***_
a5277aa17f0f10a481da9e9751ccaeef_***_Helen, Davies_***_0000-0003-4838-9572
09da4807d902e139e89b80e6cd3e8fd5_***_Daniel, Britton_***_
author Peter, Davies
Helen, Davies
Daniel, Britton
author2 Peter Davies
Helen Davies
I. Watkins
Daniel Britton
format Journal article
container_title The International Journal of Advanced Manufacturing Technology
container_volume 109
container_issue 7-8
container_start_page 2049
publishDate 2020
institution Swansea University
issn 0268-3768
1433-3015
doi_str_mv 10.1007/s00170-020-05725-9
publisher Springer Science and Business Media LLC
college_str College of Engineering
hierarchytype
hierarchy_top_id collegeofengineering
hierarchy_top_title College of Engineering
hierarchy_parent_id collegeofengineering
hierarchy_parent_title College of Engineering
department_str Engineering{{{_:::_}}}College of Engineering{{{_:::_}}}Engineering
document_store_str 1
active_str 0
description Powder interlayer bonding (PIB) is a joining technique originally developed to enable high-integrity repairs of aerospace components. The technique has previously been employed for the joining of titanium and nickel alloys utilised in the aerospace industry. This study expands on the application of the novel joining technique known as powder interlayer bonding (PIB), to the bonding of γ titanium aluminide (TiAl) material. PIB has been used to facilitate high-integrity joints in gamma titanium aluminides (TiAl), where full densification of the joint was achieved. The PIB technique described here used a metallic powder interlayer between the two faying surfaces of γ TiAl specimens. Bonds were formed in an inert atmosphere under induction heating. The PIB technique proved capable of producing high-integrity bonds in terms of microstructural evaluation, with very limited porosity retained after the bonding cycle. A brittle Ti2Al phase can be produced with heavily oxidised powder which is susceptible to cracking and will negatively affect mechanical properties.
published_date 2020-08-01T04:22:44Z
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score 10.853667