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Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure

Chao Wei Orcid Logo, Heng Gu, Yuchen Gu, Luchao Liu, Yihe Huang, Dongxu Cheng, Zhaoqing Li, Lin Li

International Journal of Extreme Manufacturing, Volume: 4, Issue: 2, Start page: 025002

Swansea University Author: Yuchen Gu

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DOI (Published version): 10.1088/2631-7990/ac5f10

Abstract

Tungsten (W) and stainless steel (SS) are well known for the high melting point and goodcorrosion resistance respectively. Bimetallic W–SS structures would offer potential applicationsin extreme environments. In this study, a SS→W→SS sandwich structure is fabricated via aspecial laser powder bed fus...

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Published in: International Journal of Extreme Manufacturing
ISSN: 2631-8644 2631-7990
Published: IOP Publishing 2022
Online Access: Check full text

URI: https://cronfa.swan.ac.uk/Record/cronfa60650
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Abstract: Tungsten (W) and stainless steel (SS) are well known for the high melting point and goodcorrosion resistance respectively. Bimetallic W–SS structures would offer potential applicationsin extreme environments. In this study, a SS→W→SS sandwich structure is fabricated via aspecial laser powder bed fusion (LPBF) method based on an ultrasonic-assisted powderdeposition mechanism. Material characterization of the SS→W interface and W→SS interfacewas conducted, including microstructure, element distribution, phase distribution, andnano-hardness. A coupled modelling method, combining computational fluid dynamicsmodelling with discrete element method, simulated the melt pool dynamics and solidification atthe material interfaces. The study shows that the interface bonding of SS→W (SS printed on W)is the combined effect of solid-state diffusion with different elemental diffusion rates and grainboundary diffusion. The keyhole mode of the melt pool at the W→SS (W printed on SS)interface makes the pre-printed SS layers repeatedly remelted, causing the liquid W to flow intothe sub-surface of the pre-printed SS through the keyhole cavities realizing the bonding of theW→SS interface. The above interfacial bonding behaviours are significantly different from thepreviously reported bonding mechanism based on the melt pool convection during multiplematerial LPBF. The abnormal material interfacial bonding behaviours are reported for the firsttime
Keywords: multi-material additive manufacturing, laser powder bed fusion, interfacial bonding,element diffusion, keyhole mode
College: Faculty of Science and Engineering
Funders: This investigation was funded by the Engineering and Physical Science Research Council (EPSRC), UK (Grant Nos. EP/P027563/1 and EP/M028267/1), the Science and Technology Facilities Council (STFC) (Grant No. ST/R006105/1), and the Bridging for Innovators Programme of Department for Business, Energy and Industrial Strategy (BEIS), UK.
Issue: 2
Start Page: 025002

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