Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure

Wei, Chao; Gu, Heng; Gu, Yuchen; Liu, Luchao; Huang, Yihe; Cheng, Dongxu; Li, Zhaoqing; Li, Lin

doi:10.1088/2631-7990/ac5f10

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Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure

Chao Wei

, Heng Gu, Yuchen Gu, Luchao Liu, Yihe Huang, Dongxu Cheng, Zhaoqing Li, Lin Li

International Journal of Extreme Manufacturing, Volume: 4, Issue: 2, Start page: 025002

Swansea University Author: Yuchen Gu

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DOI (Published version): 10.1088/2631-7990/ac5f10

Abstract

Tungsten (W) and stainless steel (SS) are well known for the high melting point and goodcorrosion resistance respectively. Bimetallic W–SS structures would offer potential applicationsin extreme environments. In this study, a SS→W→SS sandwich structure is fabricated via aspecial laser powder bed fus...

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Published in:	International Journal of Extreme Manufacturing
ISSN:	2631-8644 2631-7990
Published:	IOP Publishing 2022
Online Access:	Check full text
URI:	https://cronfa.swan.ac.uk/Record/cronfa60650

first_indexed	2022-07-27T14:57:04Z
last_indexed	2023-01-13T19:20:56Z
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Material characterization of the SS→W interface and W→SS interfacewas conducted, including microstructure, element distribution, phase distribution, andnano-hardness. A coupled modelling method, combining computational fluid dynamicsmodelling with discrete element method, simulated the melt pool dynamics and solidification atthe material interfaces. The study shows that the interface bonding of SS→W (SS printed on W)is the combined effect of solid-state diffusion with different elemental diffusion rates and grainboundary diffusion. The keyhole mode of the melt pool at the W→SS (W printed on SS)interface makes the pre-printed SS layers repeatedly remelted, causing the liquid W to flow intothe sub-surface of the pre-printed SS through the keyhole cavities realizing the bonding of theW→SS interface. The above interfacial bonding behaviours are significantly different from thepreviously reported bonding mechanism based on the melt pool convection during multiplematerial LPBF. 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spelling	2022-07-27T15:57:33.1813710 v2 60650 2022-07-27 Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure 615b64048381eea559251d5953bb3cd6 Yuchen Gu Yuchen Gu true false 2022-07-27 EAAS Tungsten (W) and stainless steel (SS) are well known for the high melting point and goodcorrosion resistance respectively. Bimetallic W–SS structures would offer potential applicationsin extreme environments. In this study, a SS→W→SS sandwich structure is fabricated via aspecial laser powder bed fusion (LPBF) method based on an ultrasonic-assisted powderdeposition mechanism. Material characterization of the SS→W interface and W→SS interfacewas conducted, including microstructure, element distribution, phase distribution, andnano-hardness. A coupled modelling method, combining computational fluid dynamicsmodelling with discrete element method, simulated the melt pool dynamics and solidification atthe material interfaces. The study shows that the interface bonding of SS→W (SS printed on W)is the combined effect of solid-state diffusion with different elemental diffusion rates and grainboundary diffusion. The keyhole mode of the melt pool at the W→SS (W printed on SS)interface makes the pre-printed SS layers repeatedly remelted, causing the liquid W to flow intothe sub-surface of the pre-printed SS through the keyhole cavities realizing the bonding of theW→SS interface. The above interfacial bonding behaviours are significantly different from thepreviously reported bonding mechanism based on the melt pool convection during multiplematerial LPBF. The abnormal material interfacial bonding behaviours are reported for the firsttime Journal Article International Journal of Extreme Manufacturing 4 2 025002 IOP Publishing 2631-8644 2631-7990 multi-material additive manufacturing, laser powder bed fusion, interfacial bonding,element diffusion, keyhole mode 1 6 2022 2022-06-01 10.1088/2631-7990/ac5f10 http://dx.doi.org/10.1088/2631-7990/ac5f10 COLLEGE NANME Engineering and Applied Sciences School COLLEGE CODE EAAS Swansea University Another institution paid the OA fee This investigation was funded by the Engineering and Physical Science Research Council (EPSRC), UK (Grant Nos. EP/P027563/1 and EP/M028267/1), the Science and Technology Facilities Council (STFC) (Grant No. ST/R006105/1), and the Bridging for Innovators Programme of Department for Business, Energy and Industrial Strategy (BEIS), UK. 2022-07-27T15:57:33.1813710 2022-07-27T15:49:38.3349719 Faculty of Science and Engineering School of Engineering and Applied Sciences - Materials Science and Engineering Chao Wei 0000-0003-4419-9093 1 Heng Gu 2 Yuchen Gu 3 Luchao Liu 4 Yihe Huang 5 Dongxu Cheng 6 Zhaoqing Li 7 Lin Li 8 60650__24773__2d9385c4f4d84302835da3f2f7137a89.pdf 60650.VOR.pdf 2022-07-27T15:54:51.4003035 Output 7036033 application/pdf Version of Record true Distributed under the terms of a Creative Commons Attribution CC-BY 3.0 Licence. true eng https://creativecommons.org/licenses/by/3.0/
title	Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure
spellingShingle	Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure Yuchen Gu
title_short	Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure
title_full	Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure
title_fullStr	Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure
title_full_unstemmed	Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure
title_sort	Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure
author_id_str_mv	615b64048381eea559251d5953bb3cd6
author_id_fullname_str_mv	615b64048381eea559251d5953bb3cd6_***_Yuchen Gu
author	Yuchen Gu
author2	Chao Wei Heng Gu Yuchen Gu Luchao Liu Yihe Huang Dongxu Cheng Zhaoqing Li Lin Li
format	Journal article
container_title	International Journal of Extreme Manufacturing
container_volume	4
container_issue	2
container_start_page	025002
publishDate	2022
institution	Swansea University
issn	2631-8644 2631-7990
doi_str_mv	10.1088/2631-7990/ac5f10
publisher	IOP Publishing
college_str	Faculty of Science and Engineering
hierarchytype
hierarchy_top_id	facultyofscienceandengineering
hierarchy_top_title	Faculty of Science and Engineering
hierarchy_parent_id	facultyofscienceandengineering
hierarchy_parent_title	Faculty of Science and Engineering
department_str	School of Engineering and Applied Sciences - Materials Science and Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Engineering and Applied Sciences - Materials Science and Engineering
url	http://dx.doi.org/10.1088/2631-7990/ac5f10
document_store_str	1
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description	Tungsten (W) and stainless steel (SS) are well known for the high melting point and goodcorrosion resistance respectively. Bimetallic W–SS structures would offer potential applicationsin extreme environments. In this study, a SS→W→SS sandwich structure is fabricated via aspecial laser powder bed fusion (LPBF) method based on an ultrasonic-assisted powderdeposition mechanism. Material characterization of the SS→W interface and W→SS interfacewas conducted, including microstructure, element distribution, phase distribution, andnano-hardness. A coupled modelling method, combining computational fluid dynamicsmodelling with discrete element method, simulated the melt pool dynamics and solidification atthe material interfaces. The study shows that the interface bonding of SS→W (SS printed on W)is the combined effect of solid-state diffusion with different elemental diffusion rates and grainboundary diffusion. The keyhole mode of the melt pool at the W→SS (W printed on SS)interface makes the pre-printed SS layers repeatedly remelted, causing the liquid W to flow intothe sub-surface of the pre-printed SS through the keyhole cavities realizing the bonding of theW→SS interface. The above interfacial bonding behaviours are significantly different from thepreviously reported bonding mechanism based on the melt pool convection during multiplematerial LPBF. The abnormal material interfacial bonding behaviours are reported for the firsttime
published_date	2022-06-01T14:16:51Z
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score	11.048042

Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure

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