Journal article 26 views
Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
Hutao Shi 
,
Chunmin Cheng ,
Chao Sun,
Zhenyang Lei,
Gai Wu ,
Lijie Li ,
Kang Liang ,
Wei Shen ,
Sheng Liu
,
Chunmin Cheng ,
Chao Sun,
Zhenyang Lei,
Gai Wu ,
Lijie Li ,
Kang Liang ,
Wei Shen ,
Sheng Liu
IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 14, Issue: 9, Pages: 1601 - 1609
Swansea University Author:
Lijie Li
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1109/tcpmt.2024.3435835
Abstract
Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
| Published in: | IEEE Transactions on Components, Packaging and Manufacturing Technology |
|---|---|
| ISSN: | 2156-3950 2156-3985 |
| Published: |
Institute of Electrical and Electronics Engineers (IEEE)
2024
|
| Online Access: |
Check full text
|
| URI: | https://cronfa.swan.ac.uk/Record/cronfa68002 |
| Keywords: |
Diamonds, Packaging, Silicon, Heat transfer, Crosstalk, Through-silicon vias, Conductivity |
|---|---|
| College: |
Faculty of Science and Engineering |
| Funders: |
This work was supported in part by the National Natural Science
Foundation of China under Grant 52202045 and Grant 62204173, in part by
the Natural Science Foundation of Hubei Province under Grant 2022CFB606,
in part by the Knowledge Innovation Program of Wuhan-Shuguang under
Grant 2023010201020255, in part by the Fundamental Research Funds for the
Central Universities under Grant 2042023kf0112, in part by Guangdong Basic
and Applied Basic Research Foundation under Grant 2021A1515110890,
and in part by the Open Fund of Hubei Key Laboratory of Electronic
Manufacturing and Packaging Integration under Grant EMPI2024021 and
Grant EMPI2024022. |
| Issue: |
9 |
| Start Page: |
1601 |
| End Page: |
1609 |