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Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings

Hutao Shi Orcid Logo, Chunmin Cheng Orcid Logo, Chao Sun, Zhenyang Lei, Gai Wu Orcid Logo, Lijie Li Orcid Logo, Kang Liang Orcid Logo, Wei Shen Orcid Logo, Sheng Liu Orcid Logo

IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 14, Issue: 9, Pages: 1601 - 1609

Swansea University Author: Lijie Li Orcid Logo

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DOI (Published version): 10.1109/tcpmt.2024.3435835

Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN: 2156-3950 2156-3985
Published: Institute of Electrical and Electronics Engineers (IEEE) 2024
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URI: https://cronfa.swan.ac.uk/Record/cronfa68002
first_indexed 2025-01-09T20:32:21Z
last_indexed 2025-01-09T20:32:21Z
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spelling 2024-12-19T15:07:27.3948952 v2 68002 2024-10-17 Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings ed2c658b77679a28e4c1dcf95af06bd6 0000-0003-4630-7692 Lijie Li Lijie Li true false 2024-10-17 ACEM Journal Article IEEE Transactions on Components, Packaging and Manufacturing Technology 14 9 1601 1609 Institute of Electrical and Electronics Engineers (IEEE) 2156-3950 2156-3985 Diamonds, Packaging, Silicon, Heat transfer, Crosstalk, Through-silicon vias, Conductivity 30 7 2024 2024-07-30 10.1109/tcpmt.2024.3435835 COLLEGE NANME Aerospace, Civil, Electrical, and Mechanical Engineering COLLEGE CODE ACEM Swansea University This work was supported in part by the National Natural Science Foundation of China under Grant 52202045 and Grant 62204173, in part by the Natural Science Foundation of Hubei Province under Grant 2022CFB606, in part by the Knowledge Innovation Program of Wuhan-Shuguang under Grant 2023010201020255, in part by the Fundamental Research Funds for the Central Universities under Grant 2042023kf0112, in part by Guangdong Basic and Applied Basic Research Foundation under Grant 2021A1515110890, and in part by the Open Fund of Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration under Grant EMPI2024021 and Grant EMPI2024022. 2024-12-19T15:07:27.3948952 2024-10-17T12:24:26.9826221 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering Hutao Shi 0009-0008-4734-8334 1 Chunmin Cheng 0000-0001-5172-6096 2 Chao Sun 3 Zhenyang Lei 4 Gai Wu 0000-0002-9726-6328 5 Lijie Li 0000-0003-4630-7692 6 Kang Liang 0000-0003-4812-3539 7 Wei Shen 0000-0003-4389-3112 8 Sheng Liu 0000-0001-6033-078x 9
title Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
spellingShingle Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
Lijie Li
title_short Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
title_full Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
title_fullStr Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
title_full_unstemmed Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
title_sort Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
author_id_str_mv ed2c658b77679a28e4c1dcf95af06bd6
author_id_fullname_str_mv ed2c658b77679a28e4c1dcf95af06bd6_***_Lijie Li
author Lijie Li
author2 Hutao Shi
Chunmin Cheng
Chao Sun
Zhenyang Lei
Gai Wu
Lijie Li
Kang Liang
Wei Shen
Sheng Liu
format Journal article
container_title IEEE Transactions on Components, Packaging and Manufacturing Technology
container_volume 14
container_issue 9
container_start_page 1601
publishDate 2024
institution Swansea University
issn 2156-3950
2156-3985
doi_str_mv 10.1109/tcpmt.2024.3435835
publisher Institute of Electrical and Electronics Engineers (IEEE)
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering
document_store_str 0
active_str 0
published_date 2024-07-30T05:24:08Z
_version_ 1859613725857677312
score 11.099424

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