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Conference Paper/Proceeding/Abstract 493 views

Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation / Amit Das

Proceedings of the 6th Decennial International Conference on Solidification Processing

Swansea University Author: Amit Das

Published in: Proceedings of the 6th Decennial International Conference on Solidification Processing
ISBN: 978-1908549297
Published: 2017
URI: https://cronfa.swan.ac.uk/Record/cronfa34577
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Keywords: solidification, Sn-Cu solder, Intermetallic compounds (IMCs), Pb-free solder
College: College of Engineering