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Conference Paper/Proceeding/Abstract 654 views

Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation

Amit Das Orcid Logo

Proceedings of the 6th Decennial International Conference on Solidification Processing

Swansea University Author: Amit Das Orcid Logo

Published in: Proceedings of the 6th Decennial International Conference on Solidification Processing
ISBN: 978-1908549297
Published: 2017
URI: https://cronfa.swan.ac.uk/Record/cronfa34577
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first_indexed 2017-07-07T20:11:18Z
last_indexed 2018-09-13T18:42:00Z
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fullrecord <?xml version="1.0"?><rfc1807><datestamp>2018-09-13T14:20:06.0895296</datestamp><bib-version>v2</bib-version><id>34577</id><entry>2017-07-07</entry><title>Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation</title><swanseaauthors><author><sid>4d785df766daed9a857c934bb130ed8b</sid><ORCID>0000-0002-7196-6254</ORCID><firstname>Amit</firstname><surname>Das</surname><name>Amit Das</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2017-07-07</date><deptcode>MTLS</deptcode><abstract/><type>Conference Paper/Proceeding/Abstract</type><journal>Proceedings of the 6th Decennial International Conference on Solidification Processing</journal><publisher/><isbnPrint>978-1908549297</isbnPrint><keywords>solidification, Sn-Cu solder, Intermetallic compounds (IMCs), Pb-free solder</keywords><publishedDay>25</publishedDay><publishedMonth>7</publishedMonth><publishedYear>2017</publishedYear><publishedDate>2017-07-25</publishedDate><doi/><url/><notes/><college>COLLEGE NANME</college><department>Materials Science and Engineering</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>MTLS</DepartmentCode><institution>Swansea University</institution><apcterm/><lastEdited>2018-09-13T14:20:06.0895296</lastEdited><Created>2017-07-07T14:44:06.6220059</Created><path><level id="1">College of Engineering</level><level id="2">Engineering</level></path><authors><author><firstname>Amit</firstname><surname>Das</surname><orcid>0000-0002-7196-6254</orcid><order>1</order></author></authors><documents/><OutputDurs/></rfc1807>
spelling 2018-09-13T14:20:06.0895296 v2 34577 2017-07-07 Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation 4d785df766daed9a857c934bb130ed8b 0000-0002-7196-6254 Amit Das Amit Das true false 2017-07-07 MTLS Conference Paper/Proceeding/Abstract Proceedings of the 6th Decennial International Conference on Solidification Processing 978-1908549297 solidification, Sn-Cu solder, Intermetallic compounds (IMCs), Pb-free solder 25 7 2017 2017-07-25 COLLEGE NANME Materials Science and Engineering COLLEGE CODE MTLS Swansea University 2018-09-13T14:20:06.0895296 2017-07-07T14:44:06.6220059 College of Engineering Engineering Amit Das 0000-0002-7196-6254 1
title Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation
spellingShingle Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation
Amit Das
title_short Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation
title_full Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation
title_fullStr Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation
title_full_unstemmed Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation
title_sort Role of Zinc Content on Solidification and Interfacial Nucleation of Sn-Cu Solder Alloy by Experiments and Phase-field Simulation
author_id_str_mv 4d785df766daed9a857c934bb130ed8b
author_id_fullname_str_mv 4d785df766daed9a857c934bb130ed8b_***_Amit Das
author Amit Das
author2 Amit Das
format Conference Paper/Proceeding/Abstract
container_title Proceedings of the 6th Decennial International Conference on Solidification Processing
publishDate 2017
institution Swansea University
isbn 978-1908549297
college_str College of Engineering
hierarchytype
hierarchy_top_id collegeofengineering
hierarchy_top_title College of Engineering
hierarchy_parent_id collegeofengineering
hierarchy_parent_title College of Engineering
department_str Engineering{{{_:::_}}}College of Engineering{{{_:::_}}}Engineering
document_store_str 0
active_str 0
published_date 2017-07-25T03:47:13Z
_version_ 1737026157540278272
score 10.917908