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Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys / H. R. Kotadia, S. H. Mannan, Amit Das

Journal of Electronic Materials, Volume: 48, Issue: 5, Pages: 2731 - 2736

Swansea University Author: Amit Das

Abstract

In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface...

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Published in: Journal of Electronic Materials
ISSN: 0361-5235 1543-186X
Published: Springer Science and Business Media LLC 2019
Online Access: Check full text

URI: https://cronfa.swan.ac.uk/Record/cronfa48575
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Abstract: In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface depending on the solder composition. Formation of different interfacial IMCs during soldering and after prolonged aging is explained by the spalling mechanism that resulted from the depletion of Zn from the solder matrix.
Keywords: Soldering, intermetallics, wettability, spalling, lead-free solder, Sn-Zn alloys
Issue: 5
Start Page: 2731
End Page: 2736