Journal article 903 views 116 downloads
Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
H. R. Kotadia,
S. H. Mannan,
Amit Das 
Journal of Electronic Materials, Volume: 48, Issue: 5, Pages: 2731 - 2736
Swansea University Author:
Amit Das
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DOI (Published version): 10.1007/s11664-019-06941-0
Abstract
In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface...
| Published in: | Journal of Electronic Materials |
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| ISSN: | 0361-5235 1543-186X |
| Published: |
Springer Science and Business Media LLC
2019
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| Online Access: |
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa48575 |
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| Abstract: |
In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface depending on the solder composition. Formation of different interfacial IMCs during soldering and after prolonged aging is explained by the spalling mechanism that resulted from the depletion of Zn from the solder matrix. |
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| Keywords: |
Soldering, intermetallics, wettability, spalling, lead-free solder, Sn-Zn alloys |
| College: |
Faculty of Science and Engineering |
| Issue: |
5 |
| Start Page: |
2731 |
| End Page: |
2736 |