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Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys

H. R. Kotadia, S. H. Mannan, Amit Das Orcid Logo

Journal of Electronic Materials, Volume: 48, Issue: 5, Pages: 2731 - 2736

Swansea University Author: Amit Das Orcid Logo

Abstract

In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface...

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Published in: Journal of Electronic Materials
ISSN: 0361-5235 1543-186X
Published: Springer Science and Business Media LLC 2019
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URI: https://cronfa.swan.ac.uk/Record/cronfa48575
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first_indexed 2019-01-28T05:01:12Z
last_indexed 2020-10-20T02:58:31Z
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spelling 2020-10-19T13:24:11.9776521 v2 48575 2019-01-28 Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys 4d785df766daed9a857c934bb130ed8b 0000-0002-7196-6254 Amit Das Amit Das true false 2019-01-28 MTLS In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface depending on the solder composition. Formation of different interfacial IMCs during soldering and after prolonged aging is explained by the spalling mechanism that resulted from the depletion of Zn from the solder matrix. Journal Article Journal of Electronic Materials 48 5 2731 2736 Springer Science and Business Media LLC 0361-5235 1543-186X Soldering, intermetallics, wettability, spalling, lead-free solder, Sn-Zn alloys 1 5 2019 2019-05-01 10.1007/s11664-019-06941-0 COLLEGE NANME Materials Science and Engineering COLLEGE CODE MTLS Swansea University 2020-10-19T13:24:11.9776521 2019-01-28T00:09:37.9759344 H. R. Kotadia 1 S. H. Mannan 2 Amit Das 0000-0002-7196-6254 3 0048575-12022019153117.pdf kotadia2019.pdf 2019-02-12T15:31:17.0830000 Output 3367054 application/pdf Version of Record true 2019-02-12T00:00:00.0000000 true eng
title Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
spellingShingle Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
Amit Das
title_short Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
title_full Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
title_fullStr Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
title_full_unstemmed Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
title_sort Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
author_id_str_mv 4d785df766daed9a857c934bb130ed8b
author_id_fullname_str_mv 4d785df766daed9a857c934bb130ed8b_***_Amit Das
author Amit Das
author2 H. R. Kotadia
S. H. Mannan
Amit Das
format Journal article
container_title Journal of Electronic Materials
container_volume 48
container_issue 5
container_start_page 2731
publishDate 2019
institution Swansea University
issn 0361-5235
1543-186X
doi_str_mv 10.1007/s11664-019-06941-0
publisher Springer Science and Business Media LLC
document_store_str 1
active_str 0
description In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface depending on the solder composition. Formation of different interfacial IMCs during soldering and after prolonged aging is explained by the spalling mechanism that resulted from the depletion of Zn from the solder matrix.
published_date 2019-05-01T04:01:23Z
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score 10.917908