Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
| Date first appeared online | 19/10/2019 |
| DOI | 10.1007/s10854-019-02358-x |
| Authors | Abbas B., Jewell E., Searle J., Mouhamad Y. |
| Journal Name | Journal of Materials Science: Materials in Electronics |
| Volume | 30 |