No Cover Image

Journal article 98 views 25 downloads

Blended Copper and Nano-Silver Screen-Printed Circuits on FTO-Coated Glass

Bahaa Abbas, Eifion Jewell Orcid Logo, Justin Searle Orcid Logo

Journal of Electronic Materials, Volume: 53, Issue: 5, Pages: 2498 - 2503

Swansea University Authors: Bahaa Abbas, Eifion Jewell Orcid Logo, Justin Searle Orcid Logo

  • 66550.VoR.pdf

    PDF | Version of Record

    This article is licensed under a Creative Commons Attribution 4.0 International License.

    Download (1.74MB)

Abstract

Using a mixture of micro-copper and nano-silver in the production of screen-printed circuits has the potential to reduce material costs and cost variability. The fundamental premise of this study involved dispersing silver nanoparticles among the larger copper microparticles at selected ratios and s...

Full description

Published in: Journal of Electronic Materials
ISSN: 0361-5235 1543-186X
Published: Springer Science and Business Media LLC 2024
Online Access: Check full text

URI: https://cronfa.swan.ac.uk/Record/cronfa66550
Tags: Add Tag
No Tags, Be the first to tag this record!
Abstract: Using a mixture of micro-copper and nano-silver in the production of screen-printed circuits has the potential to reduce material costs and cost variability. The fundamental premise of this study involved dispersing silver nanoparticles among the larger copper microparticles at selected ratios and subsequently sintering in order to establish their resultant electrical and physical performance. Commercial materials were mixed, printed, and sintered at two thermal regimes on fluorine-doped tin oxide (FTO)-coated glass substrate. The inclusion of 25% silver provided an appreciable reduction in electrical resistance from 4.21 Ω to 0.93 Ω, with further silver additions having less impact. The thermal regime used for sintering had a secondary impact on the final electrical performance. The addition of silver reduced the adhesion to the FTO substrate, with reduced film integrity. The results show that blending inks offers the advantage of enhancing material conductivity while simultaneously reducing costs, making it a compelling area for exploration and advancement in the field of electronics manufacturing.
Keywords: Nano silver; copper inks; conductive ink; sintering
College: Faculty of Science and Engineering
Funders: The Funding was provided by Engineering and Physical Sciences Research Council, EP/N020863/1, Bahaa Abbas
Issue: 5
Start Page: 2498
End Page: 2503