Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass

Date first appeared online	28/03/2023
DOI	10.1038/s41598-023-32044-2
Authors	Abbas B., Jewell E., Searle J., Claypole T.
Journal Name	Scientific Reports
Volume	13

Documents

• 63055.pdf , Book, This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made.