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Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass

Bahaa Abbas, Eifion Jewell Orcid Logo, Yin Cheung Lau, Justin Searle Orcid Logo, Tim Claypole Orcid Logo

Scientific Reports, Volume: 13, Issue: 1

Swansea University Authors: Bahaa Abbas, Eifion Jewell Orcid Logo, Justin Searle Orcid Logo, Tim Claypole Orcid Logo

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DOI (Published version): 10.1038/s41598-023-32044-2

Abstract

Copper potentially provides a cost-effective replacement for silver in printed electronic circuitry with diverse applications in healthcare, solar energy, IOT devices and automotive applications. The primary challenge facing copper is that it readily oxidizes to its non-conductive state during the s...

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Published in: Scientific Reports
ISSN: 2045-2322
Published: Springer Science and Business Media LLC 2023
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URI: https://cronfa.swan.ac.uk/Record/cronfa63055
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The primary challenge facing copper is that it readily oxidizes to its non-conductive state during the sintering process. Photonic sintering offers a means of overcoming the oxidation by which rapid conversion from discrete nano-micro particles to fully or partially sintered products occurs. An experimental study of flash lamp sintering of mixed nano copper and mixed nano/ micro copper thick film screen printed structures on FTO coated glass was carried out. It shows that there may be multiple energy windows which can successfully sinter the thick film copper print preventing detrimental copper oxidation. Under optimum conditions, the conductivities achieved in under 1 s was (3.11&#x2013;4.3&#x2009;&#xD7;&#x2009;10&#x2013;7 &#x3A9; m) matched those achieved in 90 min at 250 &#xB0;C under reducing gas conditions, offering a significant improvement in productivity and reduced energy demand. 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spelling 2023-04-13T11:10:51.0172155 v2 63055 2023-03-31 Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass 70f72a44d3b1b045e0473147441a80d2 Bahaa Abbas Bahaa Abbas true false 13dc152c178d51abfe0634445b0acf07 0000-0002-6894-2251 Eifion Jewell Eifion Jewell true false 0e3f2c3812f181eaed11c45554d4cdd0 0000-0003-1101-075X Justin Searle Justin Searle true false 7735385522f1e68a8775b4f709e91d55 0000-0003-1393-9634 Tim Claypole Tim Claypole true false 2023-03-31 MTLS Copper potentially provides a cost-effective replacement for silver in printed electronic circuitry with diverse applications in healthcare, solar energy, IOT devices and automotive applications. The primary challenge facing copper is that it readily oxidizes to its non-conductive state during the sintering process. Photonic sintering offers a means of overcoming the oxidation by which rapid conversion from discrete nano-micro particles to fully or partially sintered products occurs. An experimental study of flash lamp sintering of mixed nano copper and mixed nano/ micro copper thick film screen printed structures on FTO coated glass was carried out. It shows that there may be multiple energy windows which can successfully sinter the thick film copper print preventing detrimental copper oxidation. Under optimum conditions, the conductivities achieved in under 1 s was (3.11–4.3 × 10–7 Ω m) matched those achieved in 90 min at 250 °C under reducing gas conditions, offering a significant improvement in productivity and reduced energy demand. Also present a good film stability of a 14% increase in line resistance of 100 N material, around 10% for the 50N50M ink and only around 2% for the 20N80M. Journal Article Scientific Reports 13 1 Springer Science and Business Media LLC 2045-2322 28 3 2023 2023-03-28 10.1038/s41598-023-32044-2 http://dx.doi.org/10.1038/s41598-023-32044-2 COLLEGE NANME Materials Science and Engineering COLLEGE CODE MTLS Swansea University External research funder(s) paid the OA fee (includes OA grants disbursed by the Library) EP/N509905/1 2023-04-13T11:10:51.0172155 2023-03-31T13:36:29.8662316 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering Bahaa Abbas 1 Eifion Jewell 0000-0002-6894-2251 2 Yin Cheung Lau 3 Justin Searle 0000-0003-1101-075X 4 Tim Claypole 0000-0003-1393-9634 5 63055__26985__4fb9d0c0f84d47089b382d48049bab52.pdf 63055.pdf 2023-04-05T09:14:46.6187252 Output 5595179 application/pdf Version of Record true This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. false eng http://creativecommons.org/licenses/by/4.0/
title Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass
spellingShingle Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass
Bahaa Abbas
Eifion Jewell
Justin Searle
Tim Claypole
title_short Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass
title_full Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass
title_fullStr Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass
title_full_unstemmed Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass
title_sort Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass
author_id_str_mv 70f72a44d3b1b045e0473147441a80d2
13dc152c178d51abfe0634445b0acf07
0e3f2c3812f181eaed11c45554d4cdd0
7735385522f1e68a8775b4f709e91d55
author_id_fullname_str_mv 70f72a44d3b1b045e0473147441a80d2_***_Bahaa Abbas
13dc152c178d51abfe0634445b0acf07_***_Eifion Jewell
0e3f2c3812f181eaed11c45554d4cdd0_***_Justin Searle
7735385522f1e68a8775b4f709e91d55_***_Tim Claypole
author Bahaa Abbas
Eifion Jewell
Justin Searle
Tim Claypole
author2 Bahaa Abbas
Eifion Jewell
Yin Cheung Lau
Justin Searle
Tim Claypole
format Journal article
container_title Scientific Reports
container_volume 13
container_issue 1
publishDate 2023
institution Swansea University
issn 2045-2322
doi_str_mv 10.1038/s41598-023-32044-2
publisher Springer Science and Business Media LLC
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering
url http://dx.doi.org/10.1038/s41598-023-32044-2
document_store_str 1
active_str 0
description Copper potentially provides a cost-effective replacement for silver in printed electronic circuitry with diverse applications in healthcare, solar energy, IOT devices and automotive applications. The primary challenge facing copper is that it readily oxidizes to its non-conductive state during the sintering process. Photonic sintering offers a means of overcoming the oxidation by which rapid conversion from discrete nano-micro particles to fully or partially sintered products occurs. An experimental study of flash lamp sintering of mixed nano copper and mixed nano/ micro copper thick film screen printed structures on FTO coated glass was carried out. It shows that there may be multiple energy windows which can successfully sinter the thick film copper print preventing detrimental copper oxidation. Under optimum conditions, the conductivities achieved in under 1 s was (3.11–4.3 × 10–7 Ω m) matched those achieved in 90 min at 250 °C under reducing gas conditions, offering a significant improvement in productivity and reduced energy demand. Also present a good film stability of a 14% increase in line resistance of 100 N material, around 10% for the 50N50M ink and only around 2% for the 20N80M.
published_date 2023-03-28T04:23:32Z
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