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Printed silver circuits for FMCG packaging

David Tudor Gethin, Eifion Huw Jewell, Tim Charles Claypole, Eifion Jewell Orcid Logo

Circuit World, Volume: 39, Issue: 4, Pages: 188 - 194

Swansea University Author: Eifion Jewell Orcid Logo

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DOI (Published version): 10.1108/CW-07-2013-0023

Abstract

Printed flexible circuits which combined conventional silicon technology will enable the realisation of many value added products such as smart packaging for the FMCG industry (fast moving consumer goods). This paper describes an investigation into integrating silicon and printable circuits for the...

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Published in: Circuit World
Published: 2013
Online Access: http://www.emeraldinsight.com/doi/abs/10.1108/CW-07-2013-0023
URI: https://cronfa.swan.ac.uk/Record/cronfa22630
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Abstract: Printed flexible circuits which combined conventional silicon technology will enable the realisation of many value added products such as smart packaging for the FMCG industry (fast moving consumer goods). This paper describes an investigation into integrating silicon and printable circuits for the FMCG packaging industry this would allow products with features such as brand protection, time temperature indicators, customer feedback and visual product enhancement. Responding to interest from the FMCG packaging industry an investigation was carried out which investigated the printing conductive silver ink on common packaging substrates Design / MethodologyStandard IC mounting patterns were screen printed using two conductive silver materials (one high silver content traditional paste and one lower silver content gel polymer) to four plastic and three paper substrates which represent common FMCG substrates (HDPE, BOPP, PET and three paper substrates). Materials were characterised in terms of material rheology while prints were characterised through electrical performance and printed film topology.FindingsThere was a significant interaction between the substrate, silver ink formulation and the resultant line quality, line topology and conductivity. On paper substrates, the absorption of binder into the substrate resulted in denser silver packing and higher conductivity for the paste material. Higher conductivities were obtained on the substrates capable of withstanding higher curing temperatures. On the polymer substrates higher conductivity could be obtained by lower content silver materials due to the denser particle packing in the cured ink film as a result of its higher solvent / lower solids components. Research limitationsFurther work should examine the interactions for other printing processes commonly used in the FMCG industry such as rotogravure of flexography and should also examine nano particle materials. Further work should also address the mechanical adhesion of silicon logic on the substrates and bottlenecks in processing.
College: College of Engineering
Issue: 4
Start Page: 188
End Page: 194