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Printed silver circuits for FMCG packaging

David Tudor Gethin, Eifion Huw Jewell, Tim Charles Claypole, Eifion Jewell Orcid Logo

Circuit World, Volume: 39, Issue: 4, Pages: 188 - 194

Swansea University Author: Eifion Jewell Orcid Logo

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DOI (Published version): 10.1108/CW-07-2013-0023

Abstract

Printed flexible circuits which combined conventional silicon technology will enable the realisation of many value added products such as smart packaging for the FMCG industry (fast moving consumer goods). This paper describes an investigation into integrating silicon and printable circuits for the...

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Published in: Circuit World
Published: 2013
Online Access: http://www.emeraldinsight.com/doi/abs/10.1108/CW-07-2013-0023
URI: https://cronfa.swan.ac.uk/Record/cronfa22630
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first_indexed 2015-07-22T02:04:14Z
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fullrecord <?xml version="1.0"?><rfc1807><datestamp>2015-07-21T11:39:07.1796051</datestamp><bib-version>v2</bib-version><id>22630</id><entry>2015-07-21</entry><title>Printed silver circuits for FMCG packaging</title><swanseaauthors><author><sid>13dc152c178d51abfe0634445b0acf07</sid><ORCID>0000-0002-6894-2251</ORCID><firstname>Eifion</firstname><surname>Jewell</surname><name>Eifion Jewell</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2015-07-21</date><deptcode>MECH</deptcode><abstract>Printed flexible circuits which combined conventional silicon technology will enable the realisation of many value added products such as smart packaging for the FMCG industry (fast moving consumer goods). This paper describes an investigation into integrating silicon and printable circuits for the FMCG packaging industry this would allow products with features such as brand protection, time temperature indicators, customer feedback and visual product enhancement. Responding to interest from the FMCG packaging industry an investigation was carried out which investigated the printing conductive silver ink on common packaging substrates Design / MethodologyStandard IC mounting patterns were screen printed using two conductive silver materials (one high silver content traditional paste and one lower silver content gel polymer) to four plastic and three paper substrates which represent common FMCG substrates (HDPE, BOPP, PET and three paper substrates). Materials were characterised in terms of material rheology while prints were characterised through electrical performance and printed film topology.FindingsThere was a significant interaction between the substrate, silver ink formulation and the resultant line quality, line topology and conductivity. On paper substrates, the absorption of binder into the substrate resulted in denser silver packing and higher conductivity for the paste material. Higher conductivities were obtained on the substrates capable of withstanding higher curing temperatures. On the polymer substrates higher conductivity could be obtained by lower content silver materials due to the denser particle packing in the cured ink film as a result of its higher solvent / lower solids components. Research limitationsFurther work should examine the interactions for other printing processes commonly used in the FMCG industry such as rotogravure of flexography and should also examine nano particle materials. Further work should also address the mechanical adhesion of silicon logic on the substrates and bottlenecks in processing.</abstract><type>Journal Article</type><journal>Circuit World</journal><volume>39</volume><journalNumber>4</journalNumber><paginationStart>188</paginationStart><paginationEnd>194</paginationEnd><publisher/><keywords/><publishedDay>1</publishedDay><publishedMonth>8</publishedMonth><publishedYear>2013</publishedYear><publishedDate>2013-08-01</publishedDate><doi>10.1108/CW-07-2013-0023</doi><url>http://www.emeraldinsight.com/doi/abs/10.1108/CW-07-2013-0023</url><notes/><college>COLLEGE NANME</college><department>Mechanical Engineering</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>MECH</DepartmentCode><institution>Swansea University</institution><apcterm/><lastEdited>2015-07-21T11:39:07.1796051</lastEdited><Created>2015-07-21T11:39:07.1796051</Created><path><level id="1">Faculty of Science and Engineering</level><level id="2">School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering</level></path><authors><author><firstname>David</firstname><surname>Tudor Gethin</surname><order>1</order></author><author><firstname>Eifion</firstname><surname>Huw Jewell</surname><order>2</order></author><author><firstname>Tim</firstname><surname>Charles Claypole</surname><order>3</order></author><author><firstname>Eifion</firstname><surname>Jewell</surname><orcid>0000-0002-6894-2251</orcid><order>4</order></author></authors><documents/><OutputDurs/></rfc1807>
spelling 2015-07-21T11:39:07.1796051 v2 22630 2015-07-21 Printed silver circuits for FMCG packaging 13dc152c178d51abfe0634445b0acf07 0000-0002-6894-2251 Eifion Jewell Eifion Jewell true false 2015-07-21 MECH Printed flexible circuits which combined conventional silicon technology will enable the realisation of many value added products such as smart packaging for the FMCG industry (fast moving consumer goods). This paper describes an investigation into integrating silicon and printable circuits for the FMCG packaging industry this would allow products with features such as brand protection, time temperature indicators, customer feedback and visual product enhancement. Responding to interest from the FMCG packaging industry an investigation was carried out which investigated the printing conductive silver ink on common packaging substrates Design / MethodologyStandard IC mounting patterns were screen printed using two conductive silver materials (one high silver content traditional paste and one lower silver content gel polymer) to four plastic and three paper substrates which represent common FMCG substrates (HDPE, BOPP, PET and three paper substrates). Materials were characterised in terms of material rheology while prints were characterised through electrical performance and printed film topology.FindingsThere was a significant interaction between the substrate, silver ink formulation and the resultant line quality, line topology and conductivity. On paper substrates, the absorption of binder into the substrate resulted in denser silver packing and higher conductivity for the paste material. Higher conductivities were obtained on the substrates capable of withstanding higher curing temperatures. On the polymer substrates higher conductivity could be obtained by lower content silver materials due to the denser particle packing in the cured ink film as a result of its higher solvent / lower solids components. Research limitationsFurther work should examine the interactions for other printing processes commonly used in the FMCG industry such as rotogravure of flexography and should also examine nano particle materials. Further work should also address the mechanical adhesion of silicon logic on the substrates and bottlenecks in processing. Journal Article Circuit World 39 4 188 194 1 8 2013 2013-08-01 10.1108/CW-07-2013-0023 http://www.emeraldinsight.com/doi/abs/10.1108/CW-07-2013-0023 COLLEGE NANME Mechanical Engineering COLLEGE CODE MECH Swansea University 2015-07-21T11:39:07.1796051 2015-07-21T11:39:07.1796051 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering David Tudor Gethin 1 Eifion Huw Jewell 2 Tim Charles Claypole 3 Eifion Jewell 0000-0002-6894-2251 4
title Printed silver circuits for FMCG packaging
spellingShingle Printed silver circuits for FMCG packaging
Eifion Jewell
title_short Printed silver circuits for FMCG packaging
title_full Printed silver circuits for FMCG packaging
title_fullStr Printed silver circuits for FMCG packaging
title_full_unstemmed Printed silver circuits for FMCG packaging
title_sort Printed silver circuits for FMCG packaging
author_id_str_mv 13dc152c178d51abfe0634445b0acf07
author_id_fullname_str_mv 13dc152c178d51abfe0634445b0acf07_***_Eifion Jewell
author Eifion Jewell
author2 David Tudor Gethin
Eifion Huw Jewell
Tim Charles Claypole
Eifion Jewell
format Journal article
container_title Circuit World
container_volume 39
container_issue 4
container_start_page 188
publishDate 2013
institution Swansea University
doi_str_mv 10.1108/CW-07-2013-0023
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Mechanical Engineering
url http://www.emeraldinsight.com/doi/abs/10.1108/CW-07-2013-0023
document_store_str 0
active_str 0
description Printed flexible circuits which combined conventional silicon technology will enable the realisation of many value added products such as smart packaging for the FMCG industry (fast moving consumer goods). This paper describes an investigation into integrating silicon and printable circuits for the FMCG packaging industry this would allow products with features such as brand protection, time temperature indicators, customer feedback and visual product enhancement. Responding to interest from the FMCG packaging industry an investigation was carried out which investigated the printing conductive silver ink on common packaging substrates Design / MethodologyStandard IC mounting patterns were screen printed using two conductive silver materials (one high silver content traditional paste and one lower silver content gel polymer) to four plastic and three paper substrates which represent common FMCG substrates (HDPE, BOPP, PET and three paper substrates). Materials were characterised in terms of material rheology while prints were characterised through electrical performance and printed film topology.FindingsThere was a significant interaction between the substrate, silver ink formulation and the resultant line quality, line topology and conductivity. On paper substrates, the absorption of binder into the substrate resulted in denser silver packing and higher conductivity for the paste material. Higher conductivities were obtained on the substrates capable of withstanding higher curing temperatures. On the polymer substrates higher conductivity could be obtained by lower content silver materials due to the denser particle packing in the cured ink film as a result of its higher solvent / lower solids components. Research limitationsFurther work should examine the interactions for other printing processes commonly used in the FMCG industry such as rotogravure of flexography and should also examine nano particle materials. Further work should also address the mechanical adhesion of silicon logic on the substrates and bottlenecks in processing.
published_date 2013-08-01T03:26:48Z
_version_ 1763750978681569280
score 11.017797

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