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Processing of nano-micro copper materials for the production of conductive circuits / BAHAA ABBAS

Swansea University Author: BAHAA ABBAS

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DOI (Published version): 10.23889/SUthesis.58697

Abstract

Copper inks potentially provide a cost-effective alternative to silver for printed electronic circuits. In glass-based applications such as PV or smart glass, they can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper...

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Published: Swansea 2021
Institution: Swansea University
Degree level: Doctoral
Degree name: Ph.D
Supervisor: Jewell, Eifion ; Searle, Justin
URI: https://cronfa.swan.ac.uk/Record/cronfa58697
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first_indexed 2021-11-18T11:16:36Z
last_indexed 2021-11-19T04:26:12Z
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spelling 2021-11-18T11:43:39.0104121 v2 58697 2021-11-18 Processing of nano-micro copper materials for the production of conductive circuits 8ec4a71c240caf5f9e76acc6f9784d25 BAHAA ABBAS BAHAA ABBAS true false 2021-11-18 Copper inks potentially provide a cost-effective alternative to silver for printed electronic circuits. In glass-based applications such as PV or smart glass, they can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper particles were systematically studied to examine the relationship between sintering temperature, sintering time and gaseous environment on the electrical qualities of the sintered printed films deposited on FTO coated glass. There is a definite interaction between the particulate nature of the ink, the sintering conditions, and the conductive properties of the film. Films containing only nano-particles provide the most conductive films with optimum sintering conditions of temperature of 225 °C for 60 minutes. The inclusion of micro particles increased the ideal sintering temperature but lowered the sintering time. An ink containing an equal mixture of nano and micro particles exhibited the lowest performance. This could be attributed to partial oxidation of the nano-particles along the conductive path, which occurs as a result of the presence of the micro particles. Other samples were photonically sintered using a PulseForge 1200 laboratory photonic sintering unit where the number of pulses, pulse power, pulse frequency and the intra pulse gap could be varied. An initial optimization study identified an operational range of photonic energy profile. The best possible line conductivity obtained using these optimum conditions was around a 1/3 of that obtained by conventional thermal sintering. This relative conductivity of photonically sintered features further deviated from conventionally sintered features as the film thickness increased and as the line width reduced. Laser / NIR techniques were found ineffective to sinter the copper ink used in this study. The possibility to manually blend copper and silver paste ink was investigated and an optimum blend of 25% silver and 75% copper could be used which had maintained conductivity, cost, and adhesion benefits. E-Thesis Swansea Nano; Micro copper; Production; Conductive circuits; Processing materials 18 11 2021 2021-11-18 10.23889/SUthesis.58697 A selection of third party content is redacted or is partially redacted from this thesis due to copyright restrictions. COLLEGE NANME COLLEGE CODE Swansea University Jewell, Eifion ; Searle, Justin Doctoral Ph.D 2021-11-18T11:43:39.0104121 2021-11-18T11:13:38.2771318 Faculty of Science and Engineering School of Engineering and Applied Sciences - Uncategorised BAHAA ABBAS 1 58697__21568__016f5c947d154215a0a5a946c4e61690.pdf Abbas_Bahaa_PhD_Thesis_Final_Redacted.pdf 2021-11-18T11:34:29.4079664 Output 12018810 application/pdf Redacted version - open access true Copyright: The author, Bahaa H. Abbas, 2021. true eng
title Processing of nano-micro copper materials for the production of conductive circuits
spellingShingle Processing of nano-micro copper materials for the production of conductive circuits
BAHAA ABBAS
title_short Processing of nano-micro copper materials for the production of conductive circuits
title_full Processing of nano-micro copper materials for the production of conductive circuits
title_fullStr Processing of nano-micro copper materials for the production of conductive circuits
title_full_unstemmed Processing of nano-micro copper materials for the production of conductive circuits
title_sort Processing of nano-micro copper materials for the production of conductive circuits
author_id_str_mv 8ec4a71c240caf5f9e76acc6f9784d25
author_id_fullname_str_mv 8ec4a71c240caf5f9e76acc6f9784d25_***_BAHAA ABBAS
author BAHAA ABBAS
author2 BAHAA ABBAS
format E-Thesis
publishDate 2021
institution Swansea University
doi_str_mv 10.23889/SUthesis.58697
college_str Faculty of Science and Engineering
hierarchytype
hierarchy_top_id facultyofscienceandengineering
hierarchy_top_title Faculty of Science and Engineering
hierarchy_parent_id facultyofscienceandengineering
hierarchy_parent_title Faculty of Science and Engineering
department_str School of Engineering and Applied Sciences - Uncategorised{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Engineering and Applied Sciences - Uncategorised
document_store_str 1
active_str 0
description Copper inks potentially provide a cost-effective alternative to silver for printed electronic circuits. In glass-based applications such as PV or smart glass, they can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper particles were systematically studied to examine the relationship between sintering temperature, sintering time and gaseous environment on the electrical qualities of the sintered printed films deposited on FTO coated glass. There is a definite interaction between the particulate nature of the ink, the sintering conditions, and the conductive properties of the film. Films containing only nano-particles provide the most conductive films with optimum sintering conditions of temperature of 225 °C for 60 minutes. The inclusion of micro particles increased the ideal sintering temperature but lowered the sintering time. An ink containing an equal mixture of nano and micro particles exhibited the lowest performance. This could be attributed to partial oxidation of the nano-particles along the conductive path, which occurs as a result of the presence of the micro particles. Other samples were photonically sintered using a PulseForge 1200 laboratory photonic sintering unit where the number of pulses, pulse power, pulse frequency and the intra pulse gap could be varied. An initial optimization study identified an operational range of photonic energy profile. The best possible line conductivity obtained using these optimum conditions was around a 1/3 of that obtained by conventional thermal sintering. This relative conductivity of photonically sintered features further deviated from conventionally sintered features as the film thickness increased and as the line width reduced. Laser / NIR techniques were found ineffective to sinter the copper ink used in this study. The possibility to manually blend copper and silver paste ink was investigated and an optimum blend of 25% silver and 75% copper could be used which had maintained conductivity, cost, and adhesion benefits.
published_date 2021-11-18T04:15:25Z
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score 11.012678

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