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Wafer Bonding for Processing Small Wafers in Large Wafer Facilities

Yasir J. Noori Orcid Logo, Ilias Skandalos Orcid Logo, Xingzhao Yan Orcid Logo, Nikolay Zhelev, Yaonan Hou Orcid Logo, Frederic Gardes

IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 14, Issue: 2, Pages: 342 - 348

Swansea University Author: Yaonan Hou Orcid Logo

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DOI (Published version): 10.1109/tcpmt.2023.3341329

Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN: 2156-3950 2156-3985
Published: Institute of Electrical and Electronics Engineers (IEEE) 2024
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URI: https://cronfa.swan.ac.uk/Record/cronfa67690
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first_indexed 2024-09-25T19:10:06Z
last_indexed 2024-09-25T19:10:06Z
id cronfa67690
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spelling v2 67690 2024-09-14 Wafer Bonding for Processing Small Wafers in Large Wafer Facilities 113975f710084997abdb26ad5fa03e8e 0000-0001-9461-3841 Yaonan Hou Yaonan Hou true false 2024-09-14 ACEM Journal Article IEEE Transactions on Components, Packaging and Manufacturing Technology 14 2 342 348 Institute of Electrical and Electronics Engineers (IEEE) 2156-3950 2156-3985 Etching, Resists, Photonics, Wafer bonding, Adhesives, Lithography, Fabrication, Semiconductor waveguides 1 2 2024 2024-02-01 10.1109/tcpmt.2023.3341329 COLLEGE NANME Aerospace, Civil, Electrical, and Mechanical Engineering COLLEGE CODE ACEM Swansea University Not Required This work was supported by the Engineering and Physical Sciences Research Council (EPSRC) under Grant EP/T028475/1 [QUantum DOts on Silicon systems for communications, information processing and sensing (QUDOS)] and Grant EP/V007629/1 (correlative Raman, SEM, and Energy Dispersive X-ray Spectroscopy (EDX) for operando electrochemistry research). 2024-09-30T14:32:02.8176631 2024-09-14T10:10:43.3025239 College of Engineering Engineering Yasir J. Noori 0000-0001-5285-8779 1 Ilias Skandalos 0000-0002-9021-1420 2 Xingzhao Yan 0000-0002-2466-3015 3 Nikolay Zhelev 4 Yaonan Hou 0000-0001-9461-3841 5 Frederic Gardes 6
title Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
spellingShingle Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
Yaonan Hou
title_short Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
title_full Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
title_fullStr Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
title_full_unstemmed Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
title_sort Wafer Bonding for Processing Small Wafers in Large Wafer Facilities
author_id_str_mv 113975f710084997abdb26ad5fa03e8e
author_id_fullname_str_mv 113975f710084997abdb26ad5fa03e8e_***_Yaonan Hou
author Yaonan Hou
author2 Yasir J. Noori
Ilias Skandalos
Xingzhao Yan
Nikolay Zhelev
Yaonan Hou
Frederic Gardes
format Journal article
container_title IEEE Transactions on Components, Packaging and Manufacturing Technology
container_volume 14
container_issue 2
container_start_page 342
publishDate 2024
institution Swansea University
issn 2156-3950
2156-3985
doi_str_mv 10.1109/tcpmt.2023.3341329
publisher Institute of Electrical and Electronics Engineers (IEEE)
college_str College of Engineering
hierarchytype
hierarchy_top_id collegeofengineering
hierarchy_top_title College of Engineering
hierarchy_parent_id collegeofengineering
hierarchy_parent_title College of Engineering
department_str Engineering{{{_:::_}}}College of Engineering{{{_:::_}}}Engineering
document_store_str 0
active_str 0
published_date 2024-02-01T14:32:01Z
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score 11.029921

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