No Cover Image

Journal article 491 views

Si/SiC bonded wafer: A route to carbon free SiO[sub 2] on SiC / Owen, Guy

Applied Physics Letters, Volume: 94, Issue: 10, Start page: 103510

Swansea University Author: Owen, Guy

Full text not available from this repository: check for access using links below.

Check full text

DOI (Published version): 10.1063/1.3099018

Published in: Applied Physics Letters
ISSN: 0003-6951
Published: 2009
Online Access: Check full text

URI: https://cronfa.swan.ac.uk/Record/cronfa5657
Tags: Add Tag
No Tags, Be the first to tag this record!
Item Description: This project developed a MEMS-based electro-osmotic pump originally for application in heat-transfer in semiconductor chips. An applied voltage pumped an ionic solution through a series of microfulidic channels resulting in a cooling effect on the semiconductor wafer and spreading heat from localised device hot-spots.The technology is now being developed for biochip applications, pumping tiny volumes of fluids to biochip sensors.It has lead to industrial interaction with etch tool manufacturer SPTS and a resulting 3-year £176k project.This is a key eneabling technology for many of the nanohealth developments at Swansea.
College: College of Engineering
Issue: 10
Start Page: 103510