Journal article 574 views
Si/SiC bonded wafer: A route to carbon free SiO[sub 2] on SiC / A Pérez-Tomás; M Lodzinski; O. J Guy; M. R Jennings; M Placidi; J Llobet; P. M Gammon; M. C Davis; J. A Covington; S. E Burrows; P. A Mawby; Owen Guy
Applied Physics Letters, Volume: 94, Issue: 10, Start page: 103510
Swansea University Author: Owen, Guy
Full text not available from this repository: check for access using links below.
Si/SiC bonded wafer: A route to carbon free SiO[sub 2] on SiC
|Published in:||Applied Physics Letters|
Check full text
No Tags, Be the first to tag this record!
This project developed a MEMS-based electro-osmotic pump originally for application in heat-transfer in semiconductor chips. An applied voltage pumped an ionic solution through a series of microfulidic channels resulting in a cooling effect on the semiconductor wafer and spreading heat from localised device hot-spots.The technology is now being developed for biochip applications, pumping tiny volumes of fluids to biochip sensors.It has lead to industrial interaction with etch tool manufacturer SPTS and a resulting 3-year £176k project.This is a key eneabling technology for many of the nanohealth developments at Swansea.
College of Engineering