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GaAs Growth on Ge‐Buffered Discontinuous (111)‐Faceted V‐Groove Silicon Substrates

Makhayeni Mtunzi Orcid Logo, Hui Jia Orcid Logo, Mateus G. Masteghin Orcid Logo, Yaonan Hou Orcid Logo, Haotian Zeng Orcid Logo, Huiwen Deng, Jae‐Seong Park, Chong Chen, Jun Li, Xingzhao Yan Orcid Logo, Ilias Skandalos Orcid Logo, Frederic Gardes, Mingchu Tang, Alwyn Seeds Orcid Logo, Huiyun Liu Orcid Logo

Advanced Physics Research, Volume: 4, Issue: 9, Start page: 2500026

Swansea University Author: Yaonan Hou Orcid Logo

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DOI (Published version): 10.1002/apxr.202500026

Abstract

The propagation of antiphase boundaries (APBs) and threading dislocations (TDs) poses a significant impediment to the realisation of high‐quality group III–V semiconductors grown on group IV platforms. The complete annihilation of APBs and a substantial reduction in threading dislocation density (TD...

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Published in: Advanced Physics Research
ISSN: 2751-1200
Published: Wiley 2025
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URI: https://cronfa.swan.ac.uk/Record/cronfa69543
Abstract: The propagation of antiphase boundaries (APBs) and threading dislocations (TDs) poses a significant impediment to the realisation of high‐quality group III–V semiconductors grown on group IV platforms. The complete annihilation of APBs and a substantial reduction in threading dislocation density (TDD) are essential for achieving high‐efficiency III–V devices compatible with complementary metal‐oxide semiconductor (CMOS) technology. In this study, a novel growth technique is proposed and developed to fabricate a faceted germanium (Ge) buffer on a discontinuous (111)‐faceted V‐groove silicon (Si) substrate with a 500 nm flat ridge width. Subsequently, a GaAs buffer is grown on the Ge/V‐groove Si virtual substrate using a ramped temperature growth process to minimise the prevalence of line and planar defects in the buffer structure. An APB‐free GaAs buffer is successfully achieved, as confirmed by cross‐sectional and plan‐view transmission electron microscopy (TEM) and atomic force microscopy (AFM) analyses. The faceted Ge buffer layer obtained through this innovative approach alleviates the stringent fabrication requirements and intricate processing typically associated with conventional continuous V‐groove Si substrates. This advancement facilitates the development of photonic integrated circuits by providing a simplified and efficient alternative substrate solution.
Keywords: antiphase boundaries, aspect ratio trapping, threading dislocations, v-groove
College: Faculty of Science and Engineering
Funders: This work was supported by the UK Engineering and Physical Sciences Research Council (EP/Z532848/1, EP/X015300/1, EP/T028475/1, EP/S024441/1, and EP/P006973/1).
Issue: 9
Start Page: 2500026