Journal article 1815 views
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs
IEEE Transactions on Electron Devices, Volume: 63, Issue: 3, Pages: 1209 - 1216
Swansea University Author:
Karol Kalna
Full text not available from this repository: check for access using links below.
DOI (Published version): 10.1109/TED.2016.2516921
Abstract
The fin-edge roughness and the TiN metal grain work function-induced variability affecting device characteristics are studied and compared between a 10.4-nm gate length In0.53Ga0.47As FinFET and a 10.7-nm gate length Si FinFET. We have analysed the impact of variability by looking on five figures of...
| Published in: | IEEE Transactions on Electron Devices |
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| ISSN: | 0018-9383 1557-9646 |
| Published: |
2016
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| Online Access: |
Check full text
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| URI: | https://cronfa.swan.ac.uk/Record/cronfa27207 |
| first_indexed |
2016-04-20T01:11:01Z |
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| last_indexed |
2023-01-11T13:59:29Z |
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cronfa27207 |
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SURis |
| fullrecord |
<?xml version="1.0"?><rfc1807><datestamp>2022-10-10T15:50:04.3513587</datestamp><bib-version>v2</bib-version><id>27207</id><entry>2016-04-19</entry><title>Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs</title><swanseaauthors><author><sid>1329a42020e44fdd13de2f20d5143253</sid><ORCID>0000-0002-6333-9189</ORCID><firstname>Karol</firstname><surname>Kalna</surname><name>Karol Kalna</name><active>true</active><ethesisStudent>false</ethesisStudent></author></swanseaauthors><date>2016-04-19</date><deptcode>ACEM</deptcode><abstract>The fin-edge roughness and the TiN metal grain work function-induced variability affecting device characteristics are studied and compared between a 10.4-nm gate length In0.53Ga0.47As FinFET and a 10.7-nm gate length Si FinFET. We have analysed the impact of variability by looking on five figures of merit (threshold voltage, sub-threshold slope, off-current, DIBL, and on-current) using the two state-of-the-art in-house-build 3-D simulation tools based on the finite-element method. Quantum-corrected 3-D drift-diffusion simulations are employed for variability studies in the sub-threshold region while, in the ON-rwillegion, we use quantum-corrected 3-D ensemble Monte Carlo simulations. The In0.53Ga0.47As FinFET is more resistant to the fin-edge roughness and metal grain work function variability in the sub-threshold compared with the Si FinFET due to a stronger quantum carrier confinement present in the In0.53Ga0.47As channel. However, the ON-current variability is between 1.1 and 2.2 times larger for the In0.53Ga0.47As FinFET than for the Si transistor, respectively.will</abstract><type>Journal Article</type><journal>IEEE Transactions on Electron Devices</journal><volume>63</volume><journalNumber>3</journalNumber><paginationStart>1209</paginationStart><paginationEnd>1216</paginationEnd><publisher/><placeOfPublication/><isbnPrint/><isbnElectronic/><issnPrint>0018-9383</issnPrint><issnElectronic>1557-9646</issnElectronic><keywords/><publishedDay>31</publishedDay><publishedMonth>3</publishedMonth><publishedYear>2016</publishedYear><publishedDate>2016-03-31</publishedDate><doi>10.1109/TED.2016.2516921</doi><url>http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7393821</url><notes/><college>COLLEGE NANME</college><department>Aerospace, Civil, Electrical, and Mechanical Engineering</department><CollegeCode>COLLEGE CODE</CollegeCode><DepartmentCode>ACEM</DepartmentCode><institution>Swansea University</institution><degreesponsorsfunders>EC, EPSRC</degreesponsorsfunders><apcterm/><funders/><projectreference/><lastEdited>2022-10-10T15:50:04.3513587</lastEdited><Created>2016-04-19T12:52:47.9770898</Created><path><level id="1">Faculty of Science and Engineering</level><level id="2">School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering</level></path><authors><author><firstname>Natalia</firstname><surname>Seoane</surname><order>1</order></author><author><firstname>Guillermo</firstname><surname>Indalecio</surname><order>2</order></author><author><firstname>Manuel</firstname><surname>Aldegunde</surname><order>3</order></author><author><firstname>Daniel</firstname><surname>Nagy</surname><order>4</order></author><author><firstname>Muhammad A.</firstname><surname>Elmessary</surname><order>5</order></author><author><firstname>Antonio J.</firstname><surname>Garcia-Loureiro</surname><order>6</order></author><author><firstname>Karol</firstname><surname>Kalna</surname><orcid>0000-0002-6333-9189</orcid><order>7</order></author></authors><documents/><OutputDurs/></rfc1807> |
| spelling |
2022-10-10T15:50:04.3513587 v2 27207 2016-04-19 Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs 1329a42020e44fdd13de2f20d5143253 0000-0002-6333-9189 Karol Kalna Karol Kalna true false 2016-04-19 ACEM The fin-edge roughness and the TiN metal grain work function-induced variability affecting device characteristics are studied and compared between a 10.4-nm gate length In0.53Ga0.47As FinFET and a 10.7-nm gate length Si FinFET. We have analysed the impact of variability by looking on five figures of merit (threshold voltage, sub-threshold slope, off-current, DIBL, and on-current) using the two state-of-the-art in-house-build 3-D simulation tools based on the finite-element method. Quantum-corrected 3-D drift-diffusion simulations are employed for variability studies in the sub-threshold region while, in the ON-rwillegion, we use quantum-corrected 3-D ensemble Monte Carlo simulations. The In0.53Ga0.47As FinFET is more resistant to the fin-edge roughness and metal grain work function variability in the sub-threshold compared with the Si FinFET due to a stronger quantum carrier confinement present in the In0.53Ga0.47As channel. However, the ON-current variability is between 1.1 and 2.2 times larger for the In0.53Ga0.47As FinFET than for the Si transistor, respectively.will Journal Article IEEE Transactions on Electron Devices 63 3 1209 1216 0018-9383 1557-9646 31 3 2016 2016-03-31 10.1109/TED.2016.2516921 http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7393821 COLLEGE NANME Aerospace, Civil, Electrical, and Mechanical Engineering COLLEGE CODE ACEM Swansea University EC, EPSRC 2022-10-10T15:50:04.3513587 2016-04-19T12:52:47.9770898 Faculty of Science and Engineering School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering Natalia Seoane 1 Guillermo Indalecio 2 Manuel Aldegunde 3 Daniel Nagy 4 Muhammad A. Elmessary 5 Antonio J. Garcia-Loureiro 6 Karol Kalna 0000-0002-6333-9189 7 |
| title |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
| spellingShingle |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs Karol Kalna |
| title_short |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
| title_full |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
| title_fullStr |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
| title_full_unstemmed |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
| title_sort |
Comparison of Fin-Edge Roughness and Metal Grain Work Function Variability in InGaAs and Si FinFETs |
| author_id_str_mv |
1329a42020e44fdd13de2f20d5143253 |
| author_id_fullname_str_mv |
1329a42020e44fdd13de2f20d5143253_***_Karol Kalna |
| author |
Karol Kalna |
| author2 |
Natalia Seoane Guillermo Indalecio Manuel Aldegunde Daniel Nagy Muhammad A. Elmessary Antonio J. Garcia-Loureiro Karol Kalna |
| format |
Journal article |
| container_title |
IEEE Transactions on Electron Devices |
| container_volume |
63 |
| container_issue |
3 |
| container_start_page |
1209 |
| publishDate |
2016 |
| institution |
Swansea University |
| issn |
0018-9383 1557-9646 |
| doi_str_mv |
10.1109/TED.2016.2516921 |
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Faculty of Science and Engineering |
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facultyofscienceandengineering |
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Faculty of Science and Engineering |
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facultyofscienceandengineering |
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Faculty of Science and Engineering |
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School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering{{{_:::_}}}Faculty of Science and Engineering{{{_:::_}}}School of Aerospace, Civil, Electrical, General and Mechanical Engineering - Electronic and Electrical Engineering |
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http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7393821 |
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| description |
The fin-edge roughness and the TiN metal grain work function-induced variability affecting device characteristics are studied and compared between a 10.4-nm gate length In0.53Ga0.47As FinFET and a 10.7-nm gate length Si FinFET. We have analysed the impact of variability by looking on five figures of merit (threshold voltage, sub-threshold slope, off-current, DIBL, and on-current) using the two state-of-the-art in-house-build 3-D simulation tools based on the finite-element method. Quantum-corrected 3-D drift-diffusion simulations are employed for variability studies in the sub-threshold region while, in the ON-rwillegion, we use quantum-corrected 3-D ensemble Monte Carlo simulations. The In0.53Ga0.47As FinFET is more resistant to the fin-edge roughness and metal grain work function variability in the sub-threshold compared with the Si FinFET due to a stronger quantum carrier confinement present in the In0.53Ga0.47As channel. However, the ON-current variability is between 1.1 and 2.2 times larger for the In0.53Ga0.47As FinFET than for the Si transistor, respectively.will |
| published_date |
2016-03-31T05:22:31Z |
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1850825718431219712 |
| score |
11.08895 |

