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Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating

Stephen A. O. Russell, Amador Perez-Tomas, Christopher F. McConville, Craig A. Fisher, Dean P. Hamilton, Philip A. Mawby, Michael R. Jennings, Mike Jennings Orcid Logo

IEEE Journal of the Electron Devices Society, Volume: 5, Issue: 4, Pages: 256 - 261

Swansea University Author: Mike Jennings Orcid Logo

Abstract

A method to improve thermal management of β-Ga 2 O 3 FETs is demonstrated here via simulation of epitaxial growth on a 4H-SiC substrate. Using a recently published device as a model, the reduction achieved in self-heating allows the device to be driven at higher gate voltages and increases the overa...

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Published in: IEEE Journal of the Electron Devices Society
ISSN: 2168-6734
Published: 2017
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URI: https://cronfa.swan.ac.uk/Record/cronfa49903
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spelling 2019-07-29T15:02:44.7316522 v2 49903 2019-04-05 Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating e0ba5d7ece08cd70c9f8f8683996454a 0000-0003-3270-0805 Mike Jennings Mike Jennings true false 2019-04-05 EEEG A method to improve thermal management of β-Ga 2 O 3 FETs is demonstrated here via simulation of epitaxial growth on a 4H-SiC substrate. Using a recently published device as a model, the reduction achieved in self-heating allows the device to be driven at higher gate voltages and increases the overall performance. For the same operating parameters an 18% increase in peak drain current and 15% reduction in lattice temperature are observed. Device dimensions may be substantially reduced without detriment to performance and normally off operation may be achieved. Journal Article IEEE Journal of the Electron Devices Society 5 4 256 261 2168-6734 31 12 2017 2017-12-31 10.1109/JEDS.2017.2706321 COLLEGE NANME Electronic and Electrical Engineering COLLEGE CODE EEEG Swansea University 2019-07-29T15:02:44.7316522 2019-04-05T09:37:22.2171599 College of Engineering Engineering Stephen A. O. Russell 1 Amador Perez-Tomas 2 Christopher F. McConville 3 Craig A. Fisher 4 Dean P. Hamilton 5 Philip A. Mawby 6 Michael R. Jennings 7 Mike Jennings 0000-0003-3270-0805 8 0049903-05042019093937.pdf russell2017v2.pdf 2019-04-05T09:39:37.0830000 Output 3162441 application/pdf Version of Record true 2019-04-05T00:00:00.0000000 true eng
title Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating
spellingShingle Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating
Mike, Jennings
title_short Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating
title_full Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating
title_fullStr Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating
title_full_unstemmed Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating
title_sort Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating
author_id_str_mv e0ba5d7ece08cd70c9f8f8683996454a
author_id_fullname_str_mv e0ba5d7ece08cd70c9f8f8683996454a_***_Mike, Jennings_***_0000-0003-3270-0805
author Mike, Jennings
author2 Stephen A. O. Russell
Amador Perez-Tomas
Christopher F. McConville
Craig A. Fisher
Dean P. Hamilton
Philip A. Mawby
Michael R. Jennings
Mike Jennings
format Journal article
container_title IEEE Journal of the Electron Devices Society
container_volume 5
container_issue 4
container_start_page 256
publishDate 2017
institution Swansea University
issn 2168-6734
doi_str_mv 10.1109/JEDS.2017.2706321
college_str College of Engineering
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hierarchy_top_id collegeofengineering
hierarchy_top_title College of Engineering
hierarchy_parent_id collegeofengineering
hierarchy_parent_title College of Engineering
department_str Engineering{{{_:::_}}}College of Engineering{{{_:::_}}}Engineering
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description A method to improve thermal management of β-Ga 2 O 3 FETs is demonstrated here via simulation of epitaxial growth on a 4H-SiC substrate. Using a recently published device as a model, the reduction achieved in self-heating allows the device to be driven at higher gate voltages and increases the overall performance. For the same operating parameters an 18% increase in peak drain current and 15% reduction in lattice temperature are observed. Device dimensions may be substantially reduced without detriment to performance and normally off operation may be achieved.
published_date 2017-12-31T04:15:07Z
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score 10.854061